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Predicted cooling powers for multilayer capacitors based on various electrocaloric and electrode materials
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10.1063/1.3275013
/content/aip/journal/apl/95/24/10.1063/1.3275013
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/24/10.1063/1.3275013
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Lumped equivalent thermal circuit for an MLC. Both terminals provide thermal as well as electrical access. The schematic is not to scale with respect to the MLC geometries with which we work.

Image of FIG. 2.
FIG. 2.

Thermal modeling of MLCs. (a) Predicted MLC cooling powers for different EC materials, with either Ni or Ag electrodes, as a quasicontinuous linear function of and therefore MLC thickness. Calculated maximum cooling power , and estimated average cooling power , are both presented for MLCs with the same , , and as our measured MLC (, Ref. 20) of thickness 1.9 mm. (b) Values of from (a), normalized by MLC mass . EC data for Y5V at room temperature (Ref. 20); PZT at (Ref. 4) and P(VDF-TrFE) at (Ref. 6).

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/content/aip/journal/apl/95/24/10.1063/1.3275013
2009-12-17
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Predicted cooling powers for multilayer capacitors based on various electrocaloric and electrode materials
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/24/10.1063/1.3275013
10.1063/1.3275013
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