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Effects of Ni cladding layers on suppression of Ag agglomeration in Ag-based Ohmic contacts on
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10.1063/1.3206742
/content/aip/journal/apl/95/6/10.1063/1.3206742
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/6/10.1063/1.3206742
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Specific contact resistivities, and (b) light reflectance at 460 nm of the Ag, Ni/Ag and Ni/Ag/Ni contacts as a function of annealing temperature.

Image of FIG. 2.
FIG. 2.

SEM images for the (a) as-deposited Ag, annealed (b) Ag, (b) Ni/Ag, and (c) Ni/Ag/Ni contacts. Annealing was carried out at for 1 min in air ambient.

Image of FIG. 3.
FIG. 3.

HRXRD profiles of the (a) Ag, (b) Ni/Ag, and (c) Ni/Ag/Ni contacts as a function of annealing temperature.

Image of FIG. 4.
FIG. 4.

Off-axis phi scans of the Ag and Ni/Ag contacts for the GaN (0001), Ni (111), and Ag (111) reflections before and after annealing. Both contacts were annealed at for 1 min in air ambient.

Image of FIG. 5.
FIG. 5.

Interplanar spacing of Ag (111) planes for the Ag, Ni/Ag, and Ni/Ag/Ni contacts as functions of annealing temperature.

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/content/aip/journal/apl/95/6/10.1063/1.3206742
2009-08-14
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Effects of Ni cladding layers on suppression of Ag agglomeration in Ag-based Ohmic contacts on p-GaN
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/6/10.1063/1.3206742
10.1063/1.3206742
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