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Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films
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10.1063/1.3190198
/content/aip/journal/apl/95/7/10.1063/1.3190198
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/7/10.1063/1.3190198
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Film stack showing geometry for the derivation of an extended UV curing depth profile model. UV cure intensity depth profiles through the OSG film on (b) UV transparent and (c) UV absorbing underlying layers, respectively.

Image of FIG. 2.
FIG. 2.

(a) A force modulation signal image of a cross-section of a specimen containing a UV cured OSG film, (b) an elastic modulus depth profile of the OSG film measured by FM-AFM (black line) is compared with predicted one by the standing wave simulation (red line), and (c) TOF-SIMS depth profiling for the carbon content through the OSG films before and after UV curing.

Image of FIG. 3.
FIG. 3.

Simulated UV cure intensity depth profiles in 65 nm thick OSG films deposited on (a) SiCN and (c) SiN, and measured fracture energies for the OSG films on (b) SiCN and (d) SiN, respectively.

Image of FIG. 4.
FIG. 4.

Simulated UV cure intensity depth profiles in 100 nm thick OSG films deposited on (a) SiCN and (c) SiN, and measured fracture energies for the OSG films on (b) SiCN and (d) SiN, respectively.

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/content/aip/journal/apl/95/7/10.1063/1.3190198
2009-08-18
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/7/10.1063/1.3190198
10.1063/1.3190198
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