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The correlation between electron density and anchoring strength in the inorganic vertical alignment layer
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10.1063/1.3211117
/content/aip/journal/apl/95/8/10.1063/1.3211117
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/8/10.1063/1.3211117

Figures

Image of FIG. 1.
FIG. 1.

POM images for different alignments of LC on the thin films deposited by various methods and conditions. Although the oxygen concentration, , of thin films was in the range from 1.7 to 2, the alignment of LC was dependent on the deposition method.

Image of FIG. 2.
FIG. 2.

XRR data and their best fits for thin films prepared by sputtering under the various deposition conditions. The solid lines represent the best fits. The reflectivity curves were shifted vertically for visual aid. The inset at upper-right corner shows the fit at lower angle, close to critical angles. A clear shift in the critical angles toward higher angles with increasing substrate temperature is observed.

Image of FIG. 3.
FIG. 3.

Determined electron densities of the thin films from XRR data and their best fits. The thin films deposited by sputtering have relatively higher electron densities compared to others. In particular, the thin films deposited by sputtering at a higher substrate temperature have larger electron densities. LC aligns uniformly on the thin films with small electron density.

Tables

Generic image for table
Table I.

Various deposition methods and conditions for thin films.

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/content/aip/journal/apl/95/8/10.1063/1.3211117
2009-08-26
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The correlation between electron density and anchoring strength in the inorganic vertical alignment layer
http://aip.metastore.ingenta.com/content/aip/journal/apl/95/8/10.1063/1.3211117
10.1063/1.3211117
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