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Electronic structure and contact resistance at an open-end carbon nanotube and copper interface
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10.1063/1.3354077
/content/aip/journal/apl/96/10/10.1063/1.3354077
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/10/10.1063/1.3354077
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

The Cu/CNT/Cu simulation cell used in the study: (a) end-contact and (b) side-contact.

Image of FIG. 2.
FIG. 2.

LDOS of end-contact Cu/CNT/Cu two-probe system: (a) 2D LDOS contours. (b) Isosurface plot of LDOS.

Image of FIG. 3.
FIG. 3.

MOP of the end-contact Cu/CNT/Cu system: the green dots represent the Cu atoms while the blue dots represent the C atoms.

Image of FIG. 4.
FIG. 4.

(a) Transmission coefficient vs energy level at various bias voltages for both the end-contact and side-contact configurations and (b) corresponding curves of both types of CNT/Cu contacts. The “E-C” represents “end-contact,” while “S-C” represents “side-contact.”

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/content/aip/journal/apl/96/10/10.1063/1.3354077
2010-03-11
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electronic structure and contact resistance at an open-end carbon nanotube and copper interface
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/10/10.1063/1.3354077
10.1063/1.3354077
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