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Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles
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10.1063/1.3364132
/content/aip/journal/apl/96/14/10.1063/1.3364132
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/14/10.1063/1.3364132

Figures

Image of FIG. 1.
FIG. 1.

SEM cross-sectional images of the compacts before [(a) and (c)] after [(b) and (d)] annealing at : (a) and (b) pure Cu nanoparticle compacts and (c) and (d) Cu–Ag nanoparticle compacts. The arrows in (d) indicate fractured necks which are evidence of significant sintering. Scale bar is .

Image of FIG. 2.
FIG. 2.

TEM and EFTEM images of the Cu–Ag particle compact before annealing: (a) TEM image, (b) Ag jump ratio map image of (a) area, (c) Cu elemental map image (a) area, (d) particle surface area at high magnification; Ag layer is indicated by two parallel dashed lines. The scale bar: 500 nm in (c) and 10 nm in (d).

Image of FIG. 3.
FIG. 3.

TEM and EFTEM images of the Cu–Ag compact after annealing at : (a) TEM image, (b) Ag ratio map of (a) area, (c) Cu elemental map of (a) area, (d) Ag ratio map of white box area in (a). The scale bar: 300 nm in (c) and 100 nm in (d).

Tables

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Table I.

Relative density and grain size comparison between Cu and Cu–Ag particle compact before and after annealing at .

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/content/aip/journal/apl/96/14/10.1063/1.3364132
2010-04-05
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/14/10.1063/1.3364132
10.1063/1.3364132
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