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A 3D schematic of the mirror detector array addressed via microlenses.
Cross-section schematic of a single pixel of the device.
Micromirror and detector array fabrication steps.
Scanning electron microscope images of the final MEMS device (a) Spring plate mirrors with surrounding spiral TaN resistors (b) A portion of the wafer fused GaAs–GaP PIN mesa array with patterned conductive SU-8.
I-V curves illustrating the photo response of optically addressed GaAs PINs before and after wafer fusion.
Interferometry and optical addressing setup for the MEMS device (beam splitter: BS).
Interferograms showing fringe shift in shining light on the resistor MEMS device (inset). Mirror displacement vs optical intensity of the MEMS device with resistors.
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