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In situ evolution of stress gradients in Cu films induced by capping layers
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10.1063/1.3458864
/content/aip/journal/apl/96/26/10.1063/1.3458864
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/26/10.1063/1.3458864
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Cross-sectional transmission electron microscope image of -capped, Cu film geometry.

Image of FIG. 2.
FIG. 2.

Measured Cu (422) reflection vs tilt angle for -capped Cu film.

Image of FIG. 3.
FIG. 3.

Measured Cu (422) reflection vs incidence angle for -capped Cu film. Dotted line refers to extrapolated in-plane bulk value .

Image of FIG. 4.
FIG. 4.

In-plane stress measured in the bulk and near-surface regions during heating and cooling.

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/content/aip/journal/apl/96/26/10.1063/1.3458864
2010-06-29
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: In situ evolution of stress gradients in Cu films induced by capping layers
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/26/10.1063/1.3458864
10.1063/1.3458864
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