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Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects
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10.1063/1.3337102
/content/aip/journal/apl/96/9/10.1063/1.3337102
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/9/10.1063/1.3337102
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

A plot showing the leakage current as a function of time in MSSQ PLK/Cu comb pattern with 95 nm PLK. The inset shows the voltammetry response after the current measurement.

Image of FIG. 2.
FIG. 2.

A plot showing the leakage current as a function of time of a MSSQ PLK/Cu comb pattern with 95 nm PLK. The inset shows the voltammetry after the current measurement.

Image of FIG. 3.
FIG. 3.

Schematic representations of SCLC mechanism leading to the current hump; creation of a space charge care by injection of Cu to PLK through barrier (a); increase in electric field in PLK by the Ohmic relaxation at the space charge (b); disappearance of SCLC current (c).

Image of FIG. 4.
FIG. 4.

A plot showing the peak time as a function of d/E of two PLK interconnects with varying PLK widths. The mobility of Cu ions in these PLKs at room temperature was determined from a linear fit of the data to Eq. (1).

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/content/aip/journal/apl/96/9/10.1063/1.3337102
2010-03-01
2014-04-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects
http://aip.metastore.ingenta.com/content/aip/journal/apl/96/9/10.1063/1.3337102
10.1063/1.3337102
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