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A plot showing the leakage current as a function of time in MSSQ PLK/Cu comb pattern with 95 nm PLK. The inset shows the voltammetry response after the current measurement.
A plot showing the leakage current as a function of time of a MSSQ PLK/Cu comb pattern with 95 nm PLK. The inset shows the voltammetry after the current measurement.
Schematic representations of SCLC mechanism leading to the current hump; creation of a space charge care by injection of Cu to PLK through barrier (a); increase in electric field in PLK by the Ohmic relaxation at the space charge (b); disappearance of SCLC current (c).
A plot showing the peak time as a function of d/E of two PLK interconnects with varying PLK widths. The mobility of Cu ions in these PLKs at room temperature was determined from a linear fit of the data to Eq. (1).
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