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Manipulating stress in Cu/low-k dielectric nanocomposites
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10.1063/1.3578192
/content/aip/journal/apl/98/14/10.1063/1.3578192
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/14/10.1063/1.3578192
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Variation in in-plane and out-of-plane stress measured using Cu(220) lattice spacings for 250 nm wide features as a function of time under 8.6 keV x-ray exposure.

Image of FIG. 2.
FIG. 2.

Variation in total change in in-plane and out-of-plane stress measured using as a function of nominal feature width.

Image of FIG. 3.
FIG. 3.

Map of change in and , as normalized by the blanket film value, , compared to elastic simulations for the 250 nm wide Cu features.

Image of FIG. 4.
FIG. 4.

Map of change in and , as normalized by the blanket film value, , compared to elastic simulations for the 100 nm wide Cu features.

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/content/aip/journal/apl/98/14/10.1063/1.3578192
2011-04-07
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Manipulating stress in Cu/low-k dielectric nanocomposites
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/14/10.1063/1.3578192
10.1063/1.3578192
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