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Surface plasmon dispersion engineering via double-metallic Au/Ag layers for III-nitride based light-emitting diodes
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10.1063/1.3580628
/content/aip/journal/apl/98/15/10.1063/1.3580628
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/15/10.1063/1.3580628
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

SP dispersion curves of thin Ag (Au) film on GaN substrate with Ag (Au) film thicknesses of 40, 10, and 5 nm.

Image of FIG. 2.
FIG. 2.

(a) SP dispersion curves and (b) Purcell factor as a function of energy for double-metallic Au/Ag layers on GaN substrate with Au/Ag layer thicknesses of 10 nm/10 nm , 5 nm/15 nm , 3 nm/17 nm , and 1 nm/19 nm . The corresponding SP dispersion curves and Purcell factors for Ag-only/GaN and Au-only/GaN are also plotted.

Image of FIG. 3.
FIG. 3.

Electric field for double-metallic (a) Au (3 nm)/Ag (17 nm) and (b) Ag (3 nm)/Au (17 nm) layers on InGaN/GaN substrate.

Image of FIG. 4.
FIG. 4.

(a) PL spectra comparison of InGaN QWs coated with Au (6 nm)/Ag (44 nm) and control sample (with no metal coating), and (b) the enhancement ratios of PL intensities of the InGaN QWs with metal coating and without metal coating as a function of the wavelength for various double-metallic Au/Ag layers thicknesses.

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/content/aip/journal/apl/98/15/10.1063/1.3580628
2011-04-15
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Surface plasmon dispersion engineering via double-metallic Au/Ag layers for III-nitride based light-emitting diodes
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/15/10.1063/1.3580628
10.1063/1.3580628
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