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Flip chip lamination to electrically contact organic single crystals on flexible substrates
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1.
1.R. W. I. de Boer and A. F. Morpurgo, Phys. Rev. B 72, 073207 (2005).
http://dx.doi.org/10.1103/PhysRevB.72.073207
2.
2.M. Pope and C. E. Swenberg, Electronic Processes in Organic Crystals and Polymers, 2nd ed. (Oxford University Press, New York, 1999).
3.
3.S. M. Sze, Physics of Semiconductor Devices (Wiley, New York, 1981).
4.
4.S. Gamerith, A. Klug, H. Scheiber, U. Scherf, E. Moderegger, and E. List, Adv. Funct. Mater. 17, 3111 (2007).
http://dx.doi.org/10.1002/adfm.200600762
5.
5.Y. F. Lim, S. Lee, D. J. Herman, M. T. Lloyd, J. E. Anthony, and G. G. Malliaras, Appl. Phys. Lett. 93, 193301 (2008).
http://dx.doi.org/10.1063/1.3021022
6.
6.N. A. Azarova, J. W. Owen, C. A. McLellan, M. A. Grimminger, E. K. Chapman, J. E. Anthony, and O. D. Jurchescu, Org. Electron. 11, 1960 (2010).
http://dx.doi.org/10.1016/j.orgel.2010.09.008
7.
7.C. K. Chan, L. J. Richter, B. Dinardo, C. Jaye, B. R. Conrad, H. W. Ro, D. S. Germack, D. A. Fischer, D. M. DeLongchamp, and D. J. Gundlach, Appl. Phys. Lett. 96, 133304 (2010).
http://dx.doi.org/10.1063/1.3360230
8.
8.D. R. Hines, S. Mezhenny, M. Breban, E. D. Williams, V. W. Ballarotto, G. Esen, A. Southard, and M. S. Fuhrer, Appl. Phys. Lett. 86, 163101 (2005).
http://dx.doi.org/10.1063/1.1901809
9.
9.Y. L. Loo, R. L. Willett, K. W. Baldwin, and J. A. Rogers, Appl. Phys. Lett. 81, 562 (2002).
http://dx.doi.org/10.1063/1.1493226
10.
10.J. Zaumseil, T. Someya, Z. N. Bao, Y. L. Loo, R. Cirelli, and J. A. Rogers, Appl. Phys. Lett. 82, 793 (2003).
http://dx.doi.org/10.1063/1.1541941
11.
11.J. B. Kim, S. Lee, M. F. Toney, Z. H. Chen, A. Facchetti, Y. S. Kim, and Y. L. Loo, Chem. Mater. 22, 4931 (2010).
http://dx.doi.org/10.1021/cm101692a
12.
12.M. E. Gershenson, V. Podzorov, and A. F. Morpurgo, Rev. Mod. Phys. 78, 973 (2006).
http://dx.doi.org/10.1103/RevModPhys.78.973
13.
13.H. A. v. Laarhoven, C. F. J. Flipse, M. Koeberg, M. Bonn, E. Hendry, G. Orlandi, O. D. Jurchescu, T. T. M. Palstra, and A. Troisi, J. Chem. Phys. 129, 044704 (2008).
http://dx.doi.org/10.1063/1.2955462
14.
14.O. D. Jurchescu, D. A. Mourey, S. Subramanian, S. R. Parkin, B. M. Vogel, J. E. Anthony, T. N. Jackson, and D. J. Gundlach, Phys. Rev. B 80, 085201 (2009).
http://dx.doi.org/10.1103/PhysRevB.80.085201
15.
15.O. D. Jurchescu, S. Subramanian, R. J. Kline, S. D. Hudson, J. E. Anthony, T. N. Jackson, and D. J. Gundlach, Chem. Mater. 20, 6733 (2008).
http://dx.doi.org/10.1021/cm8021165
16.
16.V. Podzorov, E. Menard, A. Borissov, V. Kiryukhin, J. A. Rogers, and M. E. Gershenson, Phys. Rev. Lett. 93, 086602 (2004).
http://dx.doi.org/10.1103/PhysRevLett.93.086602
17.
17.I. N. Hulea, S. Fratini, H. Xie, C. L. Mulder, N. N. Iossad, G. Rastelli, S. Ciuchi, and A. F. Morpurgo, Nature Mater. 5, 982 (2006).
http://dx.doi.org/10.1038/nmat1774
18.
18.V. Podzorov, E. Menard, J. A. Rogers, and M. E. Gershenson, Phys. Rev. Lett. 95, 226601 (2005).
http://dx.doi.org/10.1103/PhysRevLett.95.226601
19.
19.H. Najafov, B. Lee, Q. Zhou, L. C. Feldman, and V. Podzorov, Nature Mater. 9, 938 (2010).
http://dx.doi.org/10.1038/nmat2872
20.
20.M. Coll, L. H. Miller, L. J. Richter, D. R. Hines, O. D. Jurchescu, N. Gergel-Hackett, C. A. Richter, and C. A. Hacker, J. Am. Chem. Soc. 131, 12451 (2009).
http://dx.doi.org/10.1021/ja901646j
21.
21.M. Coll, N. Gergel-Hackett, C. A. Richter, and C. A. Hacker, (unpublished).
22.
22.S. Perutz, J. Wang, E. J. Kramer, C. K. Ober, and K. Ellis, Macromolecules 31, 4272 (1998).
http://dx.doi.org/10.1021/ma9700993
23.
23.D. R. Hines, V. W. Ballarotto, E. D. Williams, Y. Shao, and S. A. Solin, J. Appl. Phys. 101, 024503 (2007).
http://dx.doi.org/10.1063/1.2403836
24.
24.J. N. Israelachvili, Intermolecular and Surface Forces (Academic, London, 1991).
25.
25.D. A. Lamprou, J. R. Smith, T. G. Nevell, E. Barbu, C. Stone, C. R. Willis, and J. Tsibouklis, Appl. Surf. Sci. 256, 5082 (2010).
http://dx.doi.org/10.1016/j.apsusc.2010.03.064
26.
26.L. Vitos, A. V. Ruban, H. L. Skriver, and J. Kollar, Surf. Sci. 411, 186 (1998).
http://dx.doi.org/10.1016/S0039-6028(98)00363-X
27.
27.P. Cosseddu and A. Bonfiglio, Appl. Phys. Lett. 88, 023506 (2006).
http://dx.doi.org/10.1063/1.2166487
28.
28.C. D. Dimitrakopoulos and P. R. L. Malenfant, Adv. Mater. (Weinheim, Ger.) 14, 99 (2002).
http://dx.doi.org/10.1002/1521-4095(20020116)14:2<99::AID-ADMA99>3.0.CO;2-9
29.
29.R. W. I. de Boer, T. M. Klapwijk, and A. F. Morpurgo, Appl. Phys. Lett. 83, 4345 (2003).
http://dx.doi.org/10.1063/1.1629144
30.
30.J. Takeya, C. Goldmann, S. Haas, K. P. Pernstich, B. Ketterer, and B. Batlogg, J. Appl. Phys. 94, 5800 (2003).
http://dx.doi.org/10.1063/1.1618919
31.
31.A. Rose, Phys. Rev. 97, 1538 (1955).
http://dx.doi.org/10.1103/PhysRev.97.1538
32.
32.O. Zmeskal, F. Schauer, and S. Nespurek, J. Phys. C 18, 1873 (1985).
http://dx.doi.org/10.1088/0022-3719/18/9/020
33.
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/content/aip/journal/apl/98/16/10.1063/1.3580610
2011-04-20
2014-07-28

Abstract

The fabrication of top metal contacts for organic devices represents a challenge and has important consequences for electrical properties of such systems. We report a robust, low-cost and nondestructive printing process, flip chip lamination, to fabricate top contacts on rubrene single crystals. The use of surface chemistry treatments with fluorinated self-assembled monolayers, combined with pliable substrates, and mild nanoimprint conditions, ensures conformal contact between ultrasmooth metal contacts and the organic crystal. Space-charge limited current measurements point to better interfacial electrical properties with the flip chip lamination-fabricated contacts compared to the analog architecture of e-beam evaporated top contacts.

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Scitation: Flip chip lamination to electrically contact organic single crystals on flexible substrates
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/16/10.1063/1.3580610
10.1063/1.3580610
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