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Flip chip lamination to electrically contact organic single crystals on flexible substrates
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The fabrication of top metal contacts for organic devices represents a challenge and has important consequences for electrical properties of such systems. We report a robust, low-cost and nondestructive printing process, flip chip lamination, to fabricate top contacts on rubrene single crystals. The use of surface chemistry treatments with fluorinated self-assembled monolayers, combined with pliable substrates, and mild nanoimprint conditions, ensures conformal contact between ultrasmooth metal contacts and the organic crystal. Space-charge limited current measurements point to better interfacial electrical properties with the flip chip lamination-fabricated contacts compared to the analog architecture of e-beam evaporated top contacts.
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