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Another kinetic mechanism of stabilizing multiple-layer surface steps
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10.1063/1.3595938
/content/aip/journal/apl/98/22/10.1063/1.3595938
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/22/10.1063/1.3595938
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Schematic of a simulation cell, consisting of substrate (blue/dark balls), deposited layers (green/light balls), and adatoms before (at arrow tails) and after (at arrow heads) one diffusion jump; and (b) corresponding Cu{111} surface in 3D.

Image of FIG. 2.
FIG. 2.

Number of multiple-layer steps (normalized by the number of atomic sites on a flat surface) as a function of time (in terms of nominal film thickness).

Image of FIG. 3.
FIG. 3.

(a) Formation rate (normalized by number of atomic sites on a flat surface) as a function of time. The inset shows the advancing surface fronts with (top) and (bottom); (b) lifetime of multiple-layer steps (in the unit of layers deposited) as a function of time.

Image of FIG. 4.
FIG. 4.

(a) Percentage of dissociation due to diffusion over multiple-layer steps; (b) additional thickness of multiple-layer steps.

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/content/aip/journal/apl/98/22/10.1063/1.3595938
2011-05-31
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Another kinetic mechanism of stabilizing multiple-layer surface steps
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/22/10.1063/1.3595938
10.1063/1.3595938
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