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Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly
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10.1063/1.3605558
/content/aip/journal/apl/98/26/10.1063/1.3605558
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/26/10.1063/1.3605558
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Figures

Image of FIG. 1.
FIG. 1.

(Color online) (a) Steps for transfer printing with an elastomeric stamp, where applied shear stresses are used to control the strength of adhesion. Inset: a schematic illustration and critical dimensions of the stamp including post and backing layer. (b) Optical micrographs collected by imaging through the transparent stamp during the printing steps. A stamp “inked” with a silicon plate (100 × 100 × 3 μm) is brought into contact with a silicon substrate, sheared by 12.5 μm (γ = 14%) in the -x-direction, and then slowly retracted to transfer the plate from stamp to substrate. Scale bars correspond to 50 μm.

Image of FIG. 2.
FIG. 2.

(Color online) (a) Measured pull-off forces required to delaminate stamps from a flat silicon substrate, as a function of shear displacement. The posts on the stamps have fixed heights of 50 μm and lateral dimensions up to 250 μm; retraction and shear velocities were fixed at 10 μm/s. (b) Normalized pull-off forces, P, from (a) as a function of shear strain (from Eq. (1)) in the post. The data from posts with different sizes collapse, approximately, onto a single line.

Image of FIG. 3.
FIG. 3.

(Color online) (a) Calculated normal stress distributions in a 200 μm wide post 1 μm above the stamp-ink interface for shear strains between 0% and 14.8%. (b) Average normal stress as a function of average shear stress at the interface for the pull-off forces in Figure 2. The stresses were determined from measured loads and applied shear displacements using a finite element model. The data collapse onto approximately a single line. (c) Strain energy release rate, G, calculated using finite element analysis, for a stamp with a post width L = 150 μm at different applied shear strains and normal forces. The pull-off force at failure can be determined from the intersection of the curves with the toughness of the interface (black dashed line shows a representative toughness of Γ0 = 50 mJ/m2). (d) Average normal stress vs. average shear stress at failure of the stamp/Si interface predicted from fracture-based finite element calculations assuming Γ0 = 50 mJ/m2. Modeling results exhibit similar behavior to the experimental results in (b).

Image of FIG. 4.
FIG. 4.

Demonstrations of printing silicon plates (100 × 100 × 3 μm) using shear to control the adhesion. (a) Yields for transfer printing onto a bare silicon substrate as a function of shear. (b) Examples of plates printed onto a structured (line and space geometry; 3 μm width, 17 μm spacing) PDMS substrate. (c) Plates printed onto a micromachined ledge on a silicon wafer. Inset: cross-sectional magnified view. (d) Overlapping, stacked plates printed onto a silicon wafer surface.

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/content/aip/journal/apl/98/26/10.1063/1.3605558
2011-06-28
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/26/10.1063/1.3605558
10.1063/1.3605558
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