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Triaxial stress distributions in Cu/low-k interconnect features
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10.1063/1.3549876
/content/aip/journal/apl/98/6/10.1063/1.3549876
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/6/10.1063/1.3549876
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Cross-sectional TEM image of 45 nm wide Cu line arrays.

Image of FIG. 2.
FIG. 2.

Principal stress components measured from x-ray diffraction as a function of Cu linewidth. The dotted line corresponds to the value of in-plane stress in the large pad regions.

Image of FIG. 3.
FIG. 3.

Averaged shear stress components as a function of Cu linewidth.

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/content/aip/journal/apl/98/6/10.1063/1.3549876
2011-02-09
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Triaxial stress distributions in Cu/low-k interconnect features
http://aip.metastore.ingenta.com/content/aip/journal/apl/98/6/10.1063/1.3549876
10.1063/1.3549876
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