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Thermal boundary resistance of copper phthalocyanine-metal interface
15.The entire sample was placed on a glass carrier, which was treated as an adiabatic boundary in the model. The voltage was measured by a lock-in amplifier. The current modulation frequency range was 6 Hz to 2 kHz, much lower than the characteristic thermal diffusion frequency for the CuPc and metal films.
16.Y. K. Koh, S. L. Singer, W. Kim, J. M. O. Zide, H. Lu, D. G. Cahill, A. Majumdar, and A. C. Gossard, J. Appl. Phys. 105, 054303 (2009).
17.The parasitic current was measured by applying voltage to two separate metal electrodes deposited on the multilayer structure, and proved to be at least 10 000 times smaller than the total current.
18.X-ray diffraction indicated identical phases present in CuPc films throughout the thickness range examined.
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Systems containing interfaces between dissimilar materials can exhibit lower thermal conductivity than their pure constituents, with important implications for thermal management and thermoelectric energy conversion. However, the heat transfer processes at such interfaces, in particular those between organic and inorganic materials, remain for the most part uncharacterized. We use vacuum thermal evaporation to grow archetypal multilayerthin films of copper phthalocyanine (CuPc) and Ag or Al, and measure their thermal conductivity as a function of interface density. We observe large thermal boundary resistance values ( for CuPc/Ag and for CuPc/Al), attributable to acoustic mismatch, heat carrier mismatch, and weak bonding.
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