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Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces
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10.1063/1.3622304
/content/aip/journal/apl/99/13/10.1063/1.3622304
http://aip.metastore.ingenta.com/content/aip/journal/apl/99/13/10.1063/1.3622304
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(Color online) Crack velocity vs. driving energy (v-Γ) curves as a function of aH2O at 323 K for copper-silica and gold-silica interfaces. The solid lines represent the reaction rate kinetics model fits for aH2O = 0.15.

Image of FIG. 2.
FIG. 2.

(Color online) (a) Fracture toughness ΓFT plotted as a function of aH2O at 323 K for copper-silica and gold-silica interfaces. In this plot, aH2O is on a log scale, (b) Copper plastic energy γp vs interfacial work of adhesion γa at 323 K.

Image of FIG. 3.
FIG. 3.

(Color online) (a) Core-level Cu 2p sub-band and Si 2p sub-band from a Cu/SiO2 interface, measured by x-ray photoelectron spectroscopy at aH2O = 0.85 and T = 323 K. Cleavage energy γxy plotted as a function of interfacial O and OH coverages for (b) breaking Cu-O/Cu-OH bonds and (c) breaking Si-O/Si-OH bonds. The schematic sketches indicate the location of Cu-O-Si bridge scission.

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/content/aip/journal/apl/99/13/10.1063/1.3622304
2011-09-26
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces
http://aip.metastore.ingenta.com/content/aip/journal/apl/99/13/10.1063/1.3622304
10.1063/1.3622304
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