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Vacancies, twins, and the thermal stability of ultrafine-grained copper
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10.1063/1.3669404
/content/aip/journal/apl/99/23/10.1063/1.3669404
http://aip.metastore.ingenta.com/content/aip/journal/apl/99/23/10.1063/1.3669404
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Figures

Image of FIG. 1.
FIG. 1.

Effect of shear strain (γ) on hardness (H) and recrystallization temperature (Trcx). (b) Trcx as a function of H. Standard deviation for temperature was small (<3 K). Points A4 and C1 correspond to copper deformed at (298 K, γ ∼ 4) and (77 K, γ ∼ 1), respectively.

Image of FIG. 2.
FIG. 2.

(Color online) (a) Effect of shear strain (γ) on stored energy (E) and activation energy (Q). (b) Recrystallization temperature (Trcx) as a function of E. Points A4 and C1 correspond to copper deformed at (298 K, γ ∼ 4) and (77 K, γ ∼ 1), respectively.

Image of FIG. 3.
FIG. 3.

(a) Representative micrographs of copper deformed at 298 K and γ ∼ 4 (inset A4), 77 K and γ ∼ 1 (insets C1-I to C1-III). (b) Histogram of twin spacing for copper deformed at 77 K and γ ∼ 1.

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/content/aip/journal/apl/99/23/10.1063/1.3669404
2011-12-09
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Vacancies, twins, and the thermal stability of ultrafine-grained copper
http://aip.metastore.ingenta.com/content/aip/journal/apl/99/23/10.1063/1.3669404
10.1063/1.3669404
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