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Influence of the Cu-Te composition and microstructure on the resistive switching of Cu-Te/Al2O3/Si cells
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10.1063/1.3621835
/content/aip/journal/apl/99/5/10.1063/1.3621835
http://aip.metastore.ingenta.com/content/aip/journal/apl/99/5/10.1063/1.3621835
/content/aip/journal/apl/99/5/10.1063/1.3621835
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/content/aip/journal/apl/99/5/10.1063/1.3621835
2011-08-01
2014-10-01
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Influence of the Cu-Te composition and microstructure on the resistive switching of Cu-Te/Al2O3/Si cells
http://aip.metastore.ingenta.com/content/aip/journal/apl/99/5/10.1063/1.3621835
10.1063/1.3621835
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