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1.
1. K. Nishio, T. Yanagishita, and H. Masuda, Adv. Mater. 17, 1293 (2005);
http://dx.doi.org/10.1002/adma.200401879
1.I. R. Gabitov, R. A. Indik, N. M. Litchinitser, A. I. Maimistov, V. M. Shalaev, and J. E. Soneson, J. Opt. Soc. Am. B 23(3), 535 (2006);
http://dx.doi.org/10.1364/JOSAB.23.000535
1.C. Hubert, A. Rumyantseva, G. Lerondel, J. Grand, S. Kostcheev, L. Billot, A. Vial, R. Bachelot, and P. Royer, Nano Lett. 5(4), 615 (2005);
http://dx.doi.org/10.1021/nl047956i
1.F. Wang and Y. Shen, Phys. Rev. Lett. 97(20), 206806 (2006);
http://dx.doi.org/10.1103/PhysRevLett.97.206806
1.H. Ataee-Esfahani, N. Fukata, and Y. Yamauchi, Chem. Lett. 39(4), 372 (2010);
http://dx.doi.org/10.1246/cl.2010.372
1.L. Wang, M. Imura, and Y. Yamauchi, Cryst. Eng. Comm. 14(22), 7594 (2012);
http://dx.doi.org/10.1039/c2ce26004b
1.L. Wang, C.-H. Liu, Y. Nemoto, N. Fukata, K.C.-W. Wu, and Y. Yamauchi, R. Soc. Chem. Adv. 2(11), 4608 (2012).
http://dx.doi.org/10.1039/C2RA20348K
2.
2. R. Mulero, A. S. Prabhu, K. J. Freedman, and M. J. Kim, J. Assoc. Lab. Autom. 15(3), 243 (2010);
http://dx.doi.org/10.1016/j.jala.2010.01.009
2.M. J. Kim, M. Wanunu, D. C. Bell, and A. Meller, Adv. Mater. 18(23), 3149 (2006).
http://dx.doi.org/10.1002/adma.200601191
3.
3. H. Masuda and K. Fukuda, Science 268(5216), 1466 (1995).
http://dx.doi.org/10.1126/science.268.5216.1466
4.
4. S. Kim, S. Lee, D. Choi, K. Lee, H. Park, and W. Hwang, Adv. Compos. Mater. 17(2), 101 (2008).
http://dx.doi.org/10.1163/156855108X295681
5.
5. L. Liu, M. Shao, L. Cheng, S. Zhuo, R. Que, and S. T. Lee, Appl. Phys. Lett. 98(7), 073114 (2011);
http://dx.doi.org/10.1063/1.3556649
5.K. S. Kim, W. H. Baek, J. M. Kim, T. S. Yoon, H. H. Lee, C. J. Kang, and Y. S. Kim, Sensors (Basel) 10(1), 765 (2010).
http://dx.doi.org/10.3390/s100100765
6.
6. K. Holmberg, Tribol. Int. 34, 801 (2001);
http://dx.doi.org/10.1016/S0301-679X(01)00078-0
6.V. V. Tsukruk and V. N. Bliznyuk, Langmuir 14, 446 (1998);
http://dx.doi.org/10.1021/la970367q
6.B. Bhushan, Tribol. Int. 28(2), 85 (1995);
http://dx.doi.org/10.1016/0301-679X(95)92698-5
6.H. Liu and B. Bhushan, Ultramicroscopy 97(1–4), 321 (2003);
http://dx.doi.org/10.1016/S0304-3991(03)00058-5
6.G. Xie, J. Ding, S. Liu, W. Xue, and J. Luo, Surf. Interface Anal. 41(4), 338 (2009).
http://dx.doi.org/10.1002/sia.3029
7.
7. D. Choi, S. Lee, S. Kim, P. Lee, K. Lee, H. Park, and W. Hwang, Scr. Mater. 58(10), 870 (2008).
http://dx.doi.org/10.1016/j.scriptamat.2008.01.001
8.
8. J. D. Whittaker, E. D. Minot, D. M. Tanenbaum, P. L. McEuen, and R. C. Davis, Nano Lett. 6(5), 953 (2006);
http://dx.doi.org/10.1021/nl060018t
8.J. S. Choi, J. S. Kim, I. S. Byun, D. H. Lee, M. J. Lee, B. H. Park, C. Lee, D. Yoon, H. Cheong, K. H. Lee, Y. W. Son, J. Y. Park, and M. Salmeron, Science 333(6042), 607 (2011);
http://dx.doi.org/10.1126/science.1207110
8.C. Dietz, M. Zerson, C. Riesch, M. Franke, and R. Magerle, Macromolecules 41, 9259 (2008).
http://dx.doi.org/10.1021/ma801236p
9.
9. C. Drummond, Phys. Rev. Lett. 109(15), 154302 (2012).
http://dx.doi.org/10.1103/PhysRevLett.109.154302
10.
10. J. Y. Park, D. F. Ogletree, P. A. Thiel, and M. Salmeron, Science 313(5784), 186 (2006).
http://dx.doi.org/10.1126/science.1125017
11.
11. J. Sweeney, F. Hausen, R. Hayes, G. B. Webber, F. Endres, M. W. Rutland, R. Bennewitz, and R. Atkin, Phys. Rev. Lett. 109(15), 155502 (2012);
http://dx.doi.org/10.1103/PhysRevLett.109.155502
11.F. Goujon, A. Ghoufi, P. Malfreyt, and D. J. Tildesley, Soft Matter 9(10), 2966 (2013).
http://dx.doi.org/10.1039/c3sm27641d
12.
12. B. K. Bammannavar, L. R. Naik, and B. K. Chougule, J. Appl. Phys. 104(6), 064123 (2008);
http://dx.doi.org/10.1063/1.2986470
12.P.-H. Chen, H.-Y. Peng, H.-Y. Liu, S.-L. Chang, T.-I. Wu, and C.-H. Cheng, Int. J. Mech. Sci. 41, 235 (1999);
http://dx.doi.org/10.1016/S0020-7403(98)00058-7
12.B. G. Han, B. Z. Han, and J. P. Ou, Sens. Actuators, A 149(1), 51 (2009);
http://dx.doi.org/10.1016/j.sna.2008.10.001
12.B. K. Gan and K. Yao, Ceram. Int. 35(5), 2061 (2009);
http://dx.doi.org/10.1016/j.ceramint.2008.11.015
12.C. Miclea, C. Tanasoiu, C. F. Miclea, L. Amarande, A. Gheorghiu, and F. N. Sima, J. Eur. Ceram. Soc. 25(12), 2397 (2005).
http://dx.doi.org/10.1016/j.jeurceramsoc.2005.03.069
13.
13. P. Xie, Q. Xiong, Y. Fang, Q. Qing, and C. M. Lieber, Nat. Nanotechnol. 7, 119 (2012);
http://dx.doi.org/10.1038/NNANO.2011.217
13.Y. F. Yuan, X. H. Xia, J. B. Wu, J. L. Yang, Y. B. Chen, and S. Y. Guo, Electrochem. Commun. 12(7), 890 (2010);
http://dx.doi.org/10.1016/j.elecom.2010.04.013
13.D.-S. Kong, J.-M. Wang, H.-B. Shao, J.-Q. Zhang, and Chunan Cao, J. Alloys Compd. 509(18), 5611 (2011);
http://dx.doi.org/10.1016/j.jallcom.2011.02.086
13.X. H. Xia, J. P. Tu, Y. Q. Zhang, Y. J. Mai, X. L. Wang, C. D. Gu, and X. B. Zhao, J. Phys. Chem. C 115(45), 22662 (2011);
http://dx.doi.org/10.1021/jp208113j
13.Y. Q. Zhang, X. H. Xia, X. L. Wang, Y. J. Mai, S. J. Shi, Y. Y. Tang, C. G. Gu, and J. P. Tu, J. Power Sources 213, 106 (2012);
http://dx.doi.org/10.1016/j.jpowsour.2012.03.052
13.T. Nagaura, F. Takeuchi, Y. Yamauchi, K. Wada, and S. Inoue, Electrochem. Commun. 10(5), 681 (2008);
http://dx.doi.org/10.1016/j.elecom.2008.02.012
13.Y. Yamauchi, T. Nagaura, K. Takai, N. Suzuki, K. Sato, N. Fukata, S. Inoue, and S. Kishimoto, J. Phys. Chem. 113, 9632 (2009).
http://dx.doi.org/10.1021/jp901421j
14.
14. H. Hertz, J. Reine Angew. Math. 1882(92), 156 (1881).
http://dx.doi.org/10.1515/crll.1882.92.156
15.
15. G. Bar and Y. Thomann, Langmuir 14, 1219 (1998);
http://dx.doi.org/10.1021/la9711544
15.B. B. Sauer, R. S. McLean, and R. R. Thomas, Langmuir. 14, 3045 (1998);
http://dx.doi.org/10.1021/la971334d
15.M. R. Vanlandingham, R. F. Eduljee, and J. W. Gillespie, Jr., J. Appl. Polym. Sci. 71, 787 (1999).
http://dx.doi.org/10.1002/(SICI)1097-4628(19990131)71:5<787::AID-APP12>3.0.CO;2-A
16.
16. K. Wang, H. Lee, R. Cooper, and H. Liang, “Time resolved, stress induced, and anisotropic phase transformation of a piezoelectric polymer,” Appl. Phys. A 95(2), 435441 (2009).
http://dx.doi.org/10.1007/s00339-008-4898-z
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/content/aip/journal/aplmater/1/3/10.1063/1.4821633
2013-09-19
2016-12-10

Abstract

Understanding the effects of electrical potential on nanoscale contacts is critically needed for design and development of nanodevices. In the present letter, we characterize the metallic nanopore structure of nickel using an atomic force microscope. The morphology, phase distribution, and tribological behavior were studied under an applied electrical potential. It was found that the increase in electrical potential resulted in reduction of friction and pull-off force (adhesion), which is attributed to the real contact area change. Results indicated that the nanoporous structured Ni enables the control of friction and adhesion, which is beneficial for the design of nanoelectromechanical systems.

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