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Gallium phosphide as a new material for anodically bonded atomic sensors
6. M. Bloch, O. Mancini, and T. McClelland, Proceedings of the 2002 IEEE International Frequency Control Symposium (IEEE, 2002), p. 505.
17. J. A. Rushton
, M. Aldous
, and M. D. Himsworth
, “The Feasibility of a Fully Miniaturized Magneto-Optical Trap for Portable Ultracold Quantum Technology
,” e-print arXiv:1405.3148
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Miniaturized atomic sensors are often fabricated using anodic bonding of silicon and borosilicate glass. Here we describe a technique for fabricating anodically bonded alkali-metal cells using GaP and Pyrex. GaP is a non-birefringent semiconductor that is transparent at alkali-metal resonance wavelengths, allowing new sensor geometries. GaP also has a higher thermal conductivity and lower He permeability than borosilicate glass and can be anodically bonded below 200 °C, which can also be advantageous in other vacuum sealing applications.
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