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/content/aip/journal/aplmater/2/8/10.1063/1.4891375
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/content/aip/journal/aplmater/2/8/10.1063/1.4891375
2014-08-06
2016-12-03

Abstract

Miniaturized atomic sensors are often fabricated using anodic bonding of silicon and borosilicate glass. Here we describe a technique for fabricating anodically bonded alkali-metal cells using GaP and Pyrex. GaP is a non-birefringent semiconductor that is transparent at alkali-metal resonance wavelengths, allowing new sensor geometries. GaP also has a higher thermal conductivity and lower He permeability than borosilicate glass and can be anodically bonded below 200 °C, which can also be advantageous in other vacuum sealing applications.

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