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Thermal properties of carbon nanotube array used for integrated circuit cooling
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View: Figures


Image of FIG. 1.
FIG. 1.

(Color online) Sample assembling in experiment.

Image of FIG. 2.
FIG. 2.

(Color online) Experimental setup for measuring the total thermal resistance and thermal conductivity of the VCNTA.

Image of FIG. 3.
FIG. 3.

Microscopic pictures for the CNT/CNF samples. (a) SEM cross section view of the CNT sample. (b) SEM top view of the CNT sample shows the high density of the CNT generated.

Image of FIG. 4.
FIG. 4.

(Color online) Calculated curves for the CNT material with a fixed interface thermal resistance and different total thermal resistances.

Image of FIG. 5.
FIG. 5.

(Color online) Fitted results of the CNT array calibrated phase shift measured from the thermal radiation from the Ni film. Thermal grease is also measured for comparison.

Image of FIG. 6.
FIG. 6.

(Color online) Relationship between the total thermal resistance of the CNTs and the applied pressure.

Image of FIG. 7.
FIG. 7.

HRTEM picture indicates the detail structure of the CNT sample (a) the “bamboo” structure of the CNTs, (b) enlarged view of the detailed structure of CNTs’ Ni top.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal properties of carbon nanotube array used for integrated circuit cooling