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Adhesion-delamination mechanics of a prestressed rectangular film adhered onto a rigid substrate
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Image of FIG. 1.
FIG. 1.

Sketch of an ideal MEMS-RF switch. (a) When an electrical potential is applied to the electrostatic pad, the bridge is forced into contact with the substrate and generates a signal. (b) At removal of potential, bridge resumes its undeformed planar.

Image of FIG. 2.
FIG. 2.

Sketch showing the film-punch system.

Image of FIG. 3.
FIG. 3.

Mechanical response for and . Delamination follows trajectory as indicated by the arrows, and the corresponding contact lengths are given by , , , and (pinch off). The two asymptotes of bending dominant and residual stress dominant are shown as dash lines.

Image of FIG. 4.
FIG. 4.

Mechanical response for ranges of and . Every curve terminates at critical values of and as shown. The dash lines join the “pinch-off” events.

Image of FIG. 5.
FIG. 5.

Gradient of as a function of punch displacement for a range of residual membrane stress as indicated. Bending dominant and residual stress dominant behaviors are characterized by and , respectively. The arrow indicates the delamination process.

Image of FIG. 6.
FIG. 6.

Contact length as a function of bridge-pad gap separation for two different adhesion energies. The trajectory corresponds to in Fig. 3.

Image of FIG. 7.
FIG. 7.

Sketch of two adjacent microbeams adhered (solid lines) and prior to adhesion (dashed).


Generic image for table
Table I.

Normalized variables.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Adhesion-delamination mechanics of a prestressed rectangular film adhered onto a rigid substrate