Sketch of an ideal MEMS-RF switch. (a) When an electrical potential is applied to the electrostatic pad, the bridge is forced into contact with the substrate and generates a signal. (b) At removal of potential, bridge resumes its undeformed planar.
Sketch showing the film-punch system.
Mechanical response for and . Delamination follows trajectory as indicated by the arrows, and the corresponding contact lengths are given by , , , and (pinch off). The two asymptotes of bending dominant and residual stress dominant are shown as dash lines.
Mechanical response for ranges of and . Every curve terminates at critical values of and as shown. The dash lines join the “pinch-off” events.
Gradient of as a function of punch displacement for a range of residual membrane stress as indicated. Bending dominant and residual stress dominant behaviors are characterized by and , respectively. The arrow indicates the delamination process.
Contact length as a function of bridge-pad gap separation for two different adhesion energies. The trajectory corresponds to in Fig. 3.
Sketch of two adjacent microbeams adhered (solid lines) and prior to adhesion (dashed).
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