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Competition between tensile and compressive stress creation during constrained thin film island coalescence
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10.1063/1.2432376
/content/aip/journal/jap/101/3/10.1063/1.2432376
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/3/10.1063/1.2432376
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematics of (a) a patterned Si substrate used to deposit Ni films, (b) island geometry during initial deposition, and (c) evolution of the island morphology on further deposition.

Image of FIG. 2.
FIG. 2.

A cross section FIB image of a patterned Ni film near the thickness that island coalescence occurs.

Image of FIG. 3.
FIG. 3.

(a) A general stress-thickness curve and current evolution profile and (b) instantaneous stress and stress-thickness variation curve for a patterned Ni film deposited at (corresponding to an overpotential of ) for an island size of .

Image of FIG. 4.
FIG. 4.

(a) General stress-thickness and current evolution curve and (b) instantaneous stress curve for an unpatterned Ni film deposition at (corresponding to an overpotential of ).

Image of FIG. 5.
FIG. 5.

Variation of the initial coalescence stress with the growth rate for patterned Ni films for different island sizes. The straight lines are linear regression fits for each island size. The error bars correspond to the inaccuracy of the smoothing scheme used for stress-thickness data.

Image of FIG. 6.
FIG. 6.

(a) Variation of steady state instantaneous stress with the island size for different growth rates; (b) log-log plot of the variation of the steady state instantaneous stress vs the island size for patterned films deposited at . The dashed line is a nonlinear regression exponential curve fit to the data set and (c) log-log of the variation of the initial coalescence stress with the island size. The dashed line is a nonlinear regression power law curve fit to the data set with an exponent of . The error bars correspond to the inaccuracy of the smoothing scheme used for stress-thickness data.

Image of FIG. 7.
FIG. 7.

Variation of the steady state instantaneous stress with growth rates for patterned films for different island sizes. The dotted lines are polynomial regression fits to the data sets.

Image of FIG. 8.
FIG. 8.

Variation in the stress-thickness by altering the growth rate between (corresponding to an overpotential of ) and ( overpotential) for a patterned Ni film of island size.

Image of FIG. 9.
FIG. 9.

A schematic to explain the variation in the grain boundary creation velocity and dihedral cusp angle with the evolution of the film profile.

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/content/aip/journal/jap/101/3/10.1063/1.2432376
2007-02-13
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Competition between tensile and compressive stress creation during constrained thin film island coalescence
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/3/10.1063/1.2432376
10.1063/1.2432376
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