1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Grain size effect on nanomechanical properties and deformation behavior of copper under nanoindentation test
Rent:
Rent this article for
USD
10.1063/1.2432873
/content/aip/journal/jap/101/3/10.1063/1.2432873
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/3/10.1063/1.2432873

Figures

Image of FIG. 1.
FIG. 1.

(a) OM micrographs of untested bulk Cu annealed at ; TEM bright-field images of untested (b) sputtered Cu film annealed at and (c) electroplated Cu film; (d) TEM bright-field image and (e) lattice image of untested electrolessly plated Cu film.

Image of FIG. 2.
FIG. 2.

X-ray diffraction patterns of bulk (BK) Cu annealed at , sputtered (SP) Cu film annealed at , electroplated (EP) Cu film, and electrolessly (EL) plated Cu film.

Image of FIG. 3.
FIG. 3.

Typical load-penetration depth curves of nanoindentation tests of bulk (BK) Cu annealed at , sputtered (SP) Cu film annealed at , electroplated (EP) Cu film, and electrolessly (EL) plated Cu film.

Image of FIG. 4.
FIG. 4.

(a) Hardness and (b) elastic modulus of bulk (BK) Cu, sputtered (SP) Cu films, electroplated (EP) Cu films, and electrolessly (EL) plated Cu films with different grain sizes.

Image of FIG. 5.
FIG. 5.

Magnified load-penetration depth curves of nanoindentation tests of bulk (BK) Cu annealed at , sputtered (SP) Cu film annealed at , electroplated (EP) Cu film, and electrolessly (EL) plated Cu film.

Image of FIG. 6.
FIG. 6.

TEM bright-field images of bulk Cu annealed at after nanoindentation tests: (a) indent mark and surrounding region and (b) deformed Cu grains in the vicinity of indent mark. The TEM specimens were first thinned, indented on thin area, and then very carefully ion milled.

Image of FIG. 7.
FIG. 7.

TEM bright-field images of sputtered Cu films annealed at after nanoindentation tests: (a) indent mark and surrounding region and (b) deformed Cu grains in the vicinity of indent mark. The TEM specimens were first thinned, indented on thin area, and then very carefully ion milled.

Image of FIG. 8.
FIG. 8.

TEM bright-field images of electroplated Cu films after nanoindentation tests: (a) indent mark and surrounding region and (b) deformed Cu grains in the vicinity of indent mark. The TEM specimens were first thinned, indented on thin area, and then very carefully ion milled.

Image of FIG. 9.
FIG. 9.

TEM bright-field images of electrolessly plated Cu films after nanoindentation tests: (a) indent mark and surrounding region and (b) deformed Cu grains in the vicinity of indent mark. The TEM specimens were first thinned, indented on thin area, and then very carefully ion milled.

Image of FIG. 10.
FIG. 10.

(a) Characteristic shear stress-penetration depth curves of nanoindentation tests and (b) critical shear stresses at yielding of bulk (BK) Cu, sputtered (SP) Cu films, electroplated (EP) Cu films, and electrolessly (EL) plated Cu films with different grain sizes.

Tables

Generic image for table
Table I.

Grain sizes and mechanical properties of bulk Cu, sputtered Cu films, electroplated Cu films, and electrolessly plated Cu films. STDV: standard deviation.

Loading

Article metrics loading...

/content/aip/journal/jap/101/3/10.1063/1.2432873
2007-02-05
2014-04-18
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Grain size effect on nanomechanical properties and deformation behavior of copper under nanoindentation test
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/3/10.1063/1.2432873
10.1063/1.2432873
SEARCH_EXPAND_ITEM