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Laser sintering of thick-film conductors for microelectronic applications
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10.1063/1.2433711
/content/aip/journal/jap/101/6/10.1063/1.2433711
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/6/10.1063/1.2433711
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic of experimental laser sintering setup.

Image of FIG. 2.
FIG. 2.

Laser sintering process.

Image of FIG. 3.
FIG. 3.

Single pass lines written at (a) and , (b) and , (c) and , and (d) and

Image of FIG. 4.
FIG. 4.

Photograph (a) and profile (b) of wide lines on a pitch.

Image of FIG. 5.
FIG. 5.

Micrographs of test patterns written at various speeds and laser powers.

Image of FIG. 6.
FIG. 6.

Cross-sectional profiles of the test patterns in Figs. 5(d), 5(e), and 5(c).

Image of FIG. 7.
FIG. 7.

dc resistance in for wire after two layers of metallization.

Image of FIG. 8.
FIG. 8.

Specific heat and thermal conductivity for (a) silver, (b) soda-lime glass, and (c) effective values used for simulating ink.

Image of FIG. 9.
FIG. 9.

Thermal profile for a laser power of and a scan speed of . (a) Surface plane, ; (b) cross section of central plane, ; and (c) cross section of plane, .

Image of FIG. 10.
FIG. 10.

Maximum temperature attained along the centerline of the ink-substrate interface for of laser power.

Image of FIG. 11.
FIG. 11.

Transient temperature for a laser power of and scan speeds of (a) and (b) for several different depths.

Image of FIG. 12.
FIG. 12.

Maximum thermal profile attained using different scan speeds and powers.

Image of FIG. 13.
FIG. 13.

Comparison between maximum temperatures with dc resistance for different process parameters.

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/content/aip/journal/jap/101/6/10.1063/1.2433711
2007-03-20
2014-04-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Laser sintering of thick-film conductors for microelectronic applications
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/6/10.1063/1.2433711
10.1063/1.2433711
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