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The effect of deposition rate on the intrinsic stress in copper and silver thin films
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10.1063/1.2712150
/content/aip/journal/jap/101/6/10.1063/1.2712150
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/6/10.1063/1.2712150

Figures

Image of FIG. 1.
FIG. 1.

Stress evolution as observed by the curvature of an elastic substrate, which is proportional to the product of the average stress and the film thickness .

Image of FIG. 2.
FIG. 2.

(a) Film thickness at the tensile maximum vs deposition rate for copper thin films. (b) The average stress at the tensile maximum vs deposition rate for copper thin films.

Image of FIG. 3.
FIG. 3.

(a) Film thickness at the tensile maximum vs deposition rate for silver thin films. (b) The average stress at the tensile maximum vs deposition rate for silver thin films.

Image of FIG. 4.
FIG. 4.

(a) Incremental compressive stress at a thickness of in copper thin films deposited at a single deposition rate. The solid line is a linear fit with a slope of . (b) Incremental compressive stress at a thickness of in silver thin films deposited at a single deposition rate. The solid line is a linear fit with a slope of .

Image of FIG. 5.
FIG. 5.

(a) Alternating deposition of a copper thin film. (Top) The magnitude of the incremental compressive stress as a function of film thickness. (Bottom) as a function of film thickness. (b) Alternating deposition of a copper thin film. (Top) The magnitude of the incremental compressive stress as a function of film thickness. (Bottom) as a function of film thickness.

Image of FIG. 6.
FIG. 6.

Alternating deposition of a silver thin film. (Top) The magnitude of the incremental compressive stress as a function of film thickness. (Bottom) as a function of film thickness.

Image of FIG. 7.
FIG. 7.

(a) A log-log plot of in MPa at the tensile maximum vs film thickness in nm at the tensile maximum for copper thin films. The line is a linear fit with slope of . (b) A log-log plot of in MPa at the tensile maximum vs film thickness in nm at the tensile maximum for silver thin films. The line is a linear fit with slope of .

Image of FIG. 8.
FIG. 8.

Schematic diagram of the incoherent twin boundaries formed during deposition of a fcc metal. The growth sequence of the matrix is . Nucleation of the layer leads to formation of a twin, which continues to grow in the sequence . The gaps close up to form incoherent twin boundaries that contain partial dislocations. The resultant Burgers vectors of these dislocations correspond to tension in the growing film.

Image of FIG. 9.
FIG. 9.

Definition of and .

Tables

Generic image for table
Table I.

Change in the magnitude of the incremental compressive stress for the data shown in Fig. 5(a). The errors are those of the linear fit to the stress evolution data.

Generic image for table
Table II.

Change in the magnitude of the incremental compressive stress for the data shown in Fig. 5(b). The errors are those of the linear fit to the stress evolution data.

Generic image for table
Table III.

Change in the magnitude of the incremental compressive stress for the data shown in Fig. 6. The errors are those of the linear fit to the stress evolution data.

Generic image for table
Table IV.

Material parameters for Cu and Ag for calculation of heat flux.

Generic image for table
Table V.

Material parameters for Si calculation of heat flux.

Generic image for table
Table VI.

System parameters for calculation of the heat flux.

Generic image for table
Table VII.

Estimates of heat flux onto the film using the parameters in Tables IV and VI.

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/content/aip/journal/jap/101/6/10.1063/1.2712150
2007-03-22
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The effect of deposition rate on the intrinsic stress in copper and silver thin films
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/6/10.1063/1.2712150
10.1063/1.2712150
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