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In situ stress evolution during sputter deposition of bilayers and multilayers
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10.1063/1.2719688
/content/aip/journal/jap/101/7/10.1063/1.2719688
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/7/10.1063/1.2719688

Figures

Image of FIG. 1.
FIG. 1.

Evolution of the force per unit width during deposition of 15-nm-thick Cu and Co layers onto substrates as a function of the mean film thickness.

Image of FIG. 2.
FIG. 2.

(a) Evolution of the force per unit width during deposition of 5-nm-thick Co top layers onto Cu underlayers with thicknesses of 3, 5, 7, and 10 nm (squares) as well as onto (dashed). (b) Sequence of SEM images of the Cu underlayers with thicknesses of 3, 5, 7, and 10 nm (left column) and of respective bilayers with a Co thickness of 5 nm (right column).

Image of FIG. 3.
FIG. 3.

(a) Evolution of the force per unit width during deposition of 5-nm-thick Cu top layers onto Co under layers with thicknesses of 3, 5, 7, and 10 nm (squares) as well as onto (dashed). (b) Sequence of SEM images of the Co under layers with thicknesses of 3, 5, 7, and 10 nm (left column) and of respective bilayers with a Cu thickness of 5 nm (right column).

Image of FIG. 4.
FIG. 4.

Example of the force per unit width evolution during deposition of a multilayer with a thickness of 5 nm for individual Cu and Co layers and 30 stacks of bilayers.

Image of FIG. 5.
FIG. 5.

Evolution of the force per unit width of bilayers in the steady-state region of multilayer growth as a function of the thickness of the individual Cu and Co layers.

Image of FIG. 6.
FIG. 6.

Evolution of the force per unit width in the steady-state region of multilayer growth during deposition of (a) Cu onto and Co, respectively, and (b) Co deposited onto and Cu, respectively.

Image of FIG. 7.
FIG. 7.

Evolution of the instantaneous stress in the steady-state region during deposition of (a) Cu onto , (b) Cu onto Co, (c) Co onto , (d) Co onto Cu.

Image of FIG. 8.
FIG. 8.

Stress and morphology of a multilayer consisting of 20 bilayers with thicknesses of 10 and 5 nm for Cu and Co, respectively: (a) Evolution of the force per unit width, (b) cross-section EFTEM image sensitive to Cu, which shows a regular layer structure with a thickness ratio of about 2:1 in agreement with the thickness measurements, and (c) cross-section TEM bright field micrograph revealing the grain structure, some grain boundaries are marked by white lines.

Tables

Generic image for table
Table I.

Parameters for bulk Cu and Co.

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/content/aip/journal/jap/101/7/10.1063/1.2719688
2007-04-05
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: In situ stress evolution during sputter deposition of Cu∕Co bilayers and multilayers
http://aip.metastore.ingenta.com/content/aip/journal/jap/101/7/10.1063/1.2719688
10.1063/1.2719688
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