(a) Schematic images of U-shaped domain wall Deesaw (DW seesaw) operation, (b) DW seesaw memory cell, and (c) topological image of U-shaped pattern.
Magnetization curves ( curves) for laminated films and NiFe–Cu alloy films: (a) easy axis, (b) hard axis magnetization for films, (c) easy axis, and (d) hard axis for NiFe–Cu films.
Additives composition dependence of (a) magnetization and (b) anisotropy field in and NiFe–Cu alloy films.
Passing current dependence of resistivity in U-shaped NiFe patterns.
Additive composition dependence of critical current density required for domain wall motion for and NiFe–Cu alloy films.
dependence of in and NiFe–Cu films.
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