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Very high current density package level electromigration test for copper interconnects
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10.1063/1.2917065
/content/aip/journal/jap/103/9/10.1063/1.2917065
http://aip.metastore.ingenta.com/content/aip/journal/jap/103/9/10.1063/1.2917065
/content/aip/journal/jap/103/9/10.1063/1.2917065
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/content/aip/journal/jap/103/9/10.1063/1.2917065
2008-05-06
2014-12-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Very high current density package level electromigration test for copper interconnects
http://aip.metastore.ingenta.com/content/aip/journal/jap/103/9/10.1063/1.2917065
10.1063/1.2917065
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