1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Very high current density package level electromigration test for copper interconnects
Rent:
Rent this article for
USD
10.1063/1.2917065
/content/aip/journal/jap/103/9/10.1063/1.2917065
http://aip.metastore.ingenta.com/content/aip/journal/jap/103/9/10.1063/1.2917065

Figures

Image of FIG. 1.
FIG. 1.

Schematic of the test structure.

Image of FIG. 2.
FIG. 2.

Sample resistance measured at room temperature prior to the actual EM test.

Image of FIG. 3.
FIG. 3.

EM failure distributions for test numbers 1–3 ( stands for the “log-normal-sigma” of the failure distribution).

Image of FIG. 4.
FIG. 4.

EM failure distributions for test numbers 7–9.

Image of FIG. 5.
FIG. 5.

Joule heating at the test temperature of in the test current density range of .

Image of FIG. 6.
FIG. 6.

Temperature rise due to Joule heating as a function of input power at the test temperature of . In order to compute the input power, median resistance among the group of samples is considered.

Image of FIG. 7.
FIG. 7.

Arrhenius relationship for the Cu DD line-via structure.

Image of FIG. 8.
FIG. 8.

Estimation of current density exponent (without Joule heating correction).

Image of FIG. 9.
FIG. 9.

Variation in current density exponent with current density.

Image of FIG. 10.
FIG. 10.

Typical resistance change profile during EM mass transport.

Image of FIG. 11.
FIG. 11.

Micrograph of a failed sample. Test conditions: and . Note that the void location indicating the failure is void growth dominated.

Image of FIG. 12.
FIG. 12.

Estimation of current density exponent with Joule heating correction.

Image of FIG. 13.
FIG. 13.

Variation in current density exponent with current density after Joule heating correction.

Tables

Generic image for table
Table I.

EM test data.

Loading

Article metrics loading...

/content/aip/journal/jap/103/9/10.1063/1.2917065
2008-05-06
2014-04-16
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Very high current density package level electromigration test for copper interconnects
http://aip.metastore.ingenta.com/content/aip/journal/jap/103/9/10.1063/1.2917065
10.1063/1.2917065
SEARCH_EXPAND_ITEM