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Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization
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10.1063/1.2968240
/content/aip/journal/jap/104/3/10.1063/1.2968240
http://aip.metastore.ingenta.com/content/aip/journal/jap/104/3/10.1063/1.2968240
/content/aip/journal/jap/104/3/10.1063/1.2968240
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/content/aip/journal/jap/104/3/10.1063/1.2968240
2008-08-08
2014-08-29
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization
http://aip.metastore.ingenta.com/content/aip/journal/jap/104/3/10.1063/1.2968240
10.1063/1.2968240
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