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Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for pitch applications
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Image of FIG. 1.
FIG. 1.

Electroplated Cu/SnAg double bumps (a) tilted view and (b) side view of Cu column/SnAg bumps.

Image of FIG. 2.
FIG. 2.

(a) Cross-sectional image of Cu/SnAg double-bump flip chip assembly and (b) magnified image of (a).

Image of FIG. 3.
FIG. 3.

PCB Cu line design for bumps contact resistance measurement: (1) chip center, (2) chip edge, and (3) chip corner.

Image of FIG. 4.
FIG. 4.

Mesh design for FEA.

Image of FIG. 5.
FIG. 5.

T/C test results of Cu/SnAg double-bump flip chip assembly (a) cumulative distribution and (b) the ratio of contact resistance of bumps over at various bump positions.

Image of FIG. 6.
FIG. 6.

SAM -scan images of Cu/SnAg double-bump flip chip assembly after (a) reliability tests RH, 1000 h and (b) T/C test, 1002 cycles.

Image of FIG. 7.
FIG. 7.

T/C failure of Cu/SnAg double-bump flip chip assembly: (a) SAM image, (b) cross-sectional image of A position (center bumps), and (c) cross-sectional image of B position (corner bumps).

Image of FIG. 8.
FIG. 8.

FEA results: (a) the deformation of a flip chip assembly at and (b) Von-Mises stress distribution during T/C.

Image of FIG. 9.
FIG. 9.

EPMA mapping results of Cu/SnAg double joints after T/C. (a) Schematic illustration of Cu/SnAg double bump, (b) SEM image of Si chip/Al pad/Cu column interface of corner bumps after 1002 thermal cycles, (c) Al mapping, (d) Ti mapping, (e) Cu mapping, and (f) Si mapping.

Image of FIG. 10.
FIG. 10.

FEA results: (a) the equivalent plastic strain, PEEQ and (b) the dissipated plastic energy density.

Image of FIG. 11.
FIG. 11.

Strain components on Cu column bumps. (a) —plastic normal strain in the -direction (transverse direction of a Si chip), (b) —plastic normal strain in the -direction (perpendicular direction of a Si chip), and (c) —plastic shear strain.

Image of FIG. 12.
FIG. 12.

Maximum normal plastic strain on Cu column bumps in the -direction in low temperature region ,


Generic image for table
Table I.

Material properties used in 2D FEA.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications