1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Molecular dynamics simulation study of deposition and annealing behaviors of Al atoms on Cu surface
Rent:
Rent this article for
USD
10.1063/1.3142382
/content/aip/journal/jap/105/11/10.1063/1.3142382
http://aip.metastore.ingenta.com/content/aip/journal/jap/105/11/10.1063/1.3142382

Figures

Image of FIG. 1.
FIG. 1.

Atomic scale surface structure evolution during Cu deposition on Ta (011) surface at room temperature.

Image of FIG. 2.
FIG. 2.

Change in rms value of surface roughness during Cu deposition on Ta (011) surface and consecutive Al deposition on the Cu surface.

Image of FIG. 3.
FIG. 3.

Atomic scale surface structure after 0.25 ML of Al (a) and 0.5 ML of Al (b) depositions on the rough Cu (111) surface.

Image of FIG. 4.
FIG. 4.

Isopotential contour of the surface before (a) and after (b) 1 ML of Al deposition on the rough Cu (111) surface.

Image of FIG. 5.
FIG. 5.

Changes in isopotential contour of the surface and compositional surface configuration during annealing at 700 K, (a) as deposited surface, (b) after 1 ns of annealing, and (c) after 2 ns of annealing.

Tables

Generic image for table
Table I.

Properties of Al, Cu, Ta, and their intermetallic compounds predicted by EAM potentials employed in this study in comparison with experimental data from literatures.

Generic image for table
Table II.

The fractions of pair type between the nearest-neighbor atoms.

Loading

Article metrics loading...

/content/aip/journal/jap/105/11/10.1063/1.3142382
2009-06-08
2014-04-16
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Molecular dynamics simulation study of deposition and annealing behaviors of Al atoms on Cu surface
http://aip.metastore.ingenta.com/content/aip/journal/jap/105/11/10.1063/1.3142382
10.1063/1.3142382
SEARCH_EXPAND_ITEM