Atomic scale surface structure evolution during Cu deposition on Ta (011) surface at room temperature.
Change in rms value of surface roughness during Cu deposition on Ta (011) surface and consecutive Al deposition on the Cu surface.
Atomic scale surface structure after 0.25 ML of Al (a) and 0.5 ML of Al (b) depositions on the rough Cu (111) surface.
Isopotential contour of the surface before (a) and after (b) 1 ML of Al deposition on the rough Cu (111) surface.
Changes in isopotential contour of the surface and compositional surface configuration during annealing at 700 K, (a) as deposited surface, (b) after 1 ns of annealing, and (c) after 2 ns of annealing.
Properties of Al, Cu, Ta, and their intermetallic compounds predicted by EAM potentials employed in this study in comparison with experimental data from literatures.
The fractions of pair type between the nearest-neighbor atoms.
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