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High thermoelectric performance BiSbTe alloy with unique low-dimensional structure
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10.1063/1.3143104
/content/aip/journal/jap/105/11/10.1063/1.3143104
http://aip.metastore.ingenta.com/content/aip/journal/jap/105/11/10.1063/1.3143104
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) diagram of the MS process indicating the free surface (FS) and the contact surface (CS) of the resulting melt-spun ribbon is shown. (b) Image of melt-spun ribbons obtained under the processing described in the experimental section. (c) SEM photo of the ribbon’s contact surface. (d) SEM photo of the ribbon’s free surface.

Image of FIG. 2.
FIG. 2.

(a) TEM image of the position near the contact surface. (b) Selected area ED pattern of (a). (c) HRTEM image of a single NC shown in (a). (d) TEM image of the free surface. [(e) and (f)] HRTEM images of coherent interfaces between dendrites shown in (d).

Image of FIG. 3.
FIG. 3.

HRTEM images of the ribbon’s cross section. (a) HRTEM image of the amorphous structure near the contact surface. (b) HRTEM image of the transition layer for amorphous crystallization. , , and are HRTEM images for marked regions: is for the amorphous structure, is for the nuclei, and is for the crystallization.

Image of FIG. 4.
FIG. 4.

Microstructure of MS-SPS bulk materials. (a) TEM image of MS-SPS. (b) HRTEM image of NCs surrounding amorphous structures, blue circles in (a). (c) HRTEM image of NCs with coherent interfaces.

Image of FIG. 5.
FIG. 5.

Microstructure of ZM-SPS bulk materials. (a) TEM image of the grain boundary of ZM-SPS. (b) HRTEM image of the boundary between grain and of ZM-SPS.

Image of FIG. 6.
FIG. 6.

Electrical transport properties for bulk materials. The temperature dependence of electrical transport properties for ZM, ZM-SPS, and MS-SPS samples: (a) electrical conductivity, (b) Seebeck coefficient, and (c) power factor.

Image of FIG. 7.
FIG. 7.

The ratio of electrical conductivity and total thermal conductivity between 300 and 400 K.

Image of FIG. 8.
FIG. 8.

Thermal transport properties for bulk materials. The temperature dependence of electrical and thermal transport properties for ZM, ZM-SPS, and MS-SPS samples: (a) total thermal conductivity and (b) lattice thermal conductivity.

Image of FIG. 9.
FIG. 9.

The crystal structure of and the calculated distances between plane Bi and Te.

Image of FIG. 10.
FIG. 10.

The temperature dependence of the figure of merit for ZM, ZM-SPS, and MS-SPS samples.

Image of FIG. 11.
FIG. 11.

The heat cycle dependence and thermal stability of the figures of merit for the MS-SPS sample at different temperatures.

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/content/aip/journal/jap/105/11/10.1063/1.3143104
2009-06-11
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: High thermoelectric performance BiSbTe alloy with unique low-dimensional structure
http://aip.metastore.ingenta.com/content/aip/journal/jap/105/11/10.1063/1.3143104
10.1063/1.3143104
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