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An investigation of electromigration induced void nucleation time statistics in short copper interconnects
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10.1063/1.3309744
/content/aip/journal/jap/107/10/10.1063/1.3309744
http://aip.metastore.ingenta.com/content/aip/journal/jap/107/10/10.1063/1.3309744
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Fast and slow grains generated randomly. Fast grains are indicated with a line through the middle. (b) Diffusivities values generated from a normal mixture (fast and slow) of diffusion activation energies.

Image of FIG. 2.
FIG. 2.

Finite Element solution to the nonlinear and linear SEM equations. The nonlinear solution [solid curve, Eq. (15)] using the MATLAB routine ODE45 and the linear solution [dashed curve, Eq. (15) with Eq. (21)].

Image of FIG. 3.
FIG. 3.

Comparison of FEM solutions to the linearized equation with a variety of mesh sizes ranging from around to .

Image of FIG. 4.
FIG. 4.

Close up of one region of Fig. 3.

Image of FIG. 5.
FIG. 5.

The nucleation time distribution (solid curve) for linear model (not lumped) compared to that obtained by a two-exponential lumped, MoM approximation (dashed-curve). and copper parameters as indicated in text. separate interconnects are simulated.

Image of FIG. 6.
FIG. 6.

A lumped element model of the interconnect. Each mesh interval is approximated by a C–R–C -element. For most calculations here an element is of length of around .

Image of FIG. 7.
FIG. 7.

Same as Fig. 5. The “true” nucleation time, solving the linear (not lumped) equation, Eq. (24), plotted against the two-exponential approximation Eq. (40).

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/content/aip/journal/jap/107/10/10.1063/1.3309744
2010-05-25
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: An investigation of electromigration induced void nucleation time statistics in short copper interconnects
http://aip.metastore.ingenta.com/content/aip/journal/jap/107/10/10.1063/1.3309744
10.1063/1.3309744
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