(a) Sample data and the best fit curve for a sample of 78 nm Au on a fused silica substrate. Also shown are the curves obtained by varying the Au thickness by ±25%. (b) The same data, this time with the film thermal conductivity varied ±25%. (c) Sample data and best fit curves for Au layers 22, 64, and 102 nm thick.
AFM cross sections for the gold films in this study. The thinnest film exhibited agglomeration and was much less smooth than the others; mean thickness was approximately 22 nm.
Film thickness data obtained for Au and Al films on fused silica substrates. The ordinate is the thickness determined from AFM cross sections while the abscissa is the FDTR value. Error bars based on two standard deviations are approximately the size of the symbols used.
Thermal conductivity data obtained for (a) Au and (b) Al films on fused silica substrates. Circles are values obtained with the FDTR method, while the squares are values computed from electrical conductivity measurements using the WF law.
(a) The sensitivity parameter, Eq. (5), for in-plane thermal conductivity, metal-substrate boundary conductance, and metal thickness, for a sample consisting of an 80 nm film of Au deposited on a fused silica substrate. (b) The same sensitivities, calculated for a sapphire substrate. The phase angle in Eq. (5) is taken in radians.
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