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Electromigration in flip chip solder joints under extra high current density
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10.1063/1.3371711
/content/aip/journal/jap/107/7/10.1063/1.3371711
http://aip.metastore.ingenta.com/content/aip/journal/jap/107/7/10.1063/1.3371711
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic drawing showing the solder joint configuration used in this study.

Image of FIG. 2.
FIG. 2.

Microstructure of the as-assembly flip chip joint before current stressing.

Image of FIG. 3.
FIG. 3.

(a) Schematic drawing showing the water cooling system with a proportional-integral-derivative controller used in this study. (b) Cut-away view showing the flip chip sample and the cooling block.

Image of FIG. 4.
FIG. 4.

Microstructures of a pair of joints that had been stressed for 10 min at without the cooling system.

Image of FIG. 5.
FIG. 5.

Microstructures of the pair of joints after 10 min of current stressing at without the cooling system. (a) Electrons flowing from the chip side into the joint. (b) Electrons flowing from the substrate side into the joint. (c) Zoom-in view for the chip side of (a). (d) Zoom-in view for the chip side of (b). (e) Zoom-in view for the substrate side of (a). (f) Zoom-in view for the substrate side of (b).

Image of FIG. 6.
FIG. 6.

Microstructures of a pair of joints after 935 h of current stressing at with the cooling system. The chip temperature was controlled at . (a) Electrons flowing from the chip side into the joint. (b) Electrons flowing from the substrate side into the joint. (c) Zoom-in view for the chip side of (a). (d) Zoom-in view for the chip side of (b). (e) Zoom-in view for the substrate side of (a). (f) Zoom-in view for the substrate side of (b).

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/content/aip/journal/jap/107/7/10.1063/1.3371711
2010-04-12
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electromigration in flip chip solder joints under extra high current density
http://aip.metastore.ingenta.com/content/aip/journal/jap/107/7/10.1063/1.3371711
10.1063/1.3371711
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