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Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu)
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10.1063/1.3505796
/content/aip/journal/jap/108/10/10.1063/1.3505796
http://aip.metastore.ingenta.com/content/aip/journal/jap/108/10/10.1063/1.3505796
/content/aip/journal/jap/108/10/10.1063/1.3505796
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/content/aip/journal/jap/108/10/10.1063/1.3505796
2010-11-23
2014-10-22
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Application of electron backscatter diffraction to the study on orientation distribution of intermetallic compounds at heterogeneous interfaces (Sn/Ag and Sn/Cu)
http://aip.metastore.ingenta.com/content/aip/journal/jap/108/10/10.1063/1.3505796
10.1063/1.3505796
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