(a) HRTEM micrograph shows the interface between Sn–Ag solder and electroplating Ni after reflowing at for 5 s. (b) SAD pattern of circular region 1 in Ni and (c) SAD pattern of circular region 2 in the solder matrix.
(a) TEM image of Sn–Ag/Ni solder interface. (b) Magnified image of region 1 in (a) reveals the Ni lattice image and the formation of a nanocrystalline NiSn compound within the amorphous diffusion zone. (c) Magnified image of dotted region in (b) shows the channel (dissolution) zone formation with a lot of discontinuous Ni lattices and vacant lattice sites between the Ni layer and an amorphous Ni–Sn diffusion zone.
(a) TEM image of Sn–Ag/Ni solder interface. (b) Magnified image of inset of (a).
Fourier filtered images of the images in Fig. 3(b). (a) Ni lattice and dissolution zone [region 1 in Fig. 3(b)] and (b) zigzag front of Ni lattice and dissolution zone [region 2 in Fig. 3(b)].
(a) TEM image of the amorphous Ni–Sn diffusion zone adjacent to the Ni layer and (b) magnified image of the inset in (a) showing the formation of nanocrystalline NiSn compounds within the amorphous region.
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