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The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate
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10.1063/1.3484493
/content/aip/journal/jap/108/6/10.1063/1.3484493
http://aip.metastore.ingenta.com/content/aip/journal/jap/108/6/10.1063/1.3484493
/content/aip/journal/jap/108/6/10.1063/1.3484493
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/content/aip/journal/jap/108/6/10.1063/1.3484493
2010-09-27
2014-10-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate
http://aip.metastore.ingenta.com/content/aip/journal/jap/108/6/10.1063/1.3484493
10.1063/1.3484493
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