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The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate
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10.1063/1.3484493
/content/aip/journal/jap/108/6/10.1063/1.3484493
http://aip.metastore.ingenta.com/content/aip/journal/jap/108/6/10.1063/1.3484493
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) HRTEM micrograph shows the interface between Sn–Ag solder and electroplating Ni after reflowing at for 5 s. (b) SAD pattern of circular region 1 in Ni and (c) SAD pattern of circular region 2 in the solder matrix.

Image of FIG. 2.
FIG. 2.

(a) TEM image of Sn–Ag/Ni solder interface. (b) Magnified image of region 1 in (a) reveals the Ni lattice image and the formation of a nanocrystalline NiSn compound within the amorphous diffusion zone. (c) Magnified image of dotted region in (b) shows the channel (dissolution) zone formation with a lot of discontinuous Ni lattices and vacant lattice sites between the Ni layer and an amorphous Ni–Sn diffusion zone.

Image of FIG. 3.
FIG. 3.

(a) TEM image of Sn–Ag/Ni solder interface. (b) Magnified image of inset of (a).

Image of FIG. 4.
FIG. 4.

Fourier filtered images of the images in Fig. 3(b). (a) Ni lattice and dissolution zone [region 1 in Fig. 3(b)] and (b) zigzag front of Ni lattice and dissolution zone [region 2 in Fig. 3(b)].

Image of FIG. 5.
FIG. 5.

(a) TEM image of the amorphous Ni–Sn diffusion zone adjacent to the Ni layer and (b) magnified image of the inset in (a) showing the formation of nanocrystalline NiSn compounds within the amorphous region.

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/content/aip/journal/jap/108/6/10.1063/1.3484493
2010-09-27
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate
http://aip.metastore.ingenta.com/content/aip/journal/jap/108/6/10.1063/1.3484493
10.1063/1.3484493
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