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Multilayered Al/CuO thermite formation by reactive magnetron sputtering: Nano versus micro
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Image of FIG. 1.
FIG. 1.

XRD patterns of the thin layers grown with oxygen partial pressures: (a) 0.05 Pa, (b) 0.08 Pa, (c) 0.10 Pa, and (d) 0.13 Pa.

Image of FIG. 2.
FIG. 2.

Transmission infrared absorption spectra of magnetron sputtered CuO films (100 nm thick), using a blank Si substrate as reference. Inset: wider frequency range for the same sample.

Image of FIG. 3.
FIG. 3.

SEM cross-section images of multilayers magnetron sputtered. A: 3 layers . B: 10 layers of CuO(100 nm)/Al(100 nm).

Image of FIG. 4.
FIG. 4.

TEM, cross-section image of multilayers magnetron sputtered Al/CuO.

Image of FIG. 5.
FIG. 5.

Dependence of the stress in the thin aluminum layer on bias.

Image of FIG. 6.
FIG. 6.

Thermal analysis diagram for microstructured (gray curve) and nanostructured samples (black curve): (a) DSC and (b) DTA.

Image of FIG. 7.
FIG. 7.

XRD pattern of C-type samples after reaction in DSC.


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Table I.

Multilayered Al/CuO deposition parameters.

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Table II.

Multilayered Al/CuO samples.

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Table III.

Stress measurements results.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Multilayered Al/CuO thermite formation by reactive magnetron sputtering: Nano versus micro