Structural formula of the organic low-k material. “R” is a ring-shaped structure that has excellent thermal stability.
Toluene isotherm of polymer-M, the inset shows the pore size distribution.
(a) k-value vs porosity; (b) Young’s modulus vs k-value for polymer-M and different CVD materials.
Schematic setup for the four-point bending test.
Multistack of the Si/Polymer-M/barrier/Copper thin films under investigation.
Schematic representation of the three possible sample configurations used during four-point bending tests.
(a)–(c) Typical load–displacement curves and corresponding fracture locations for an asymmetric sample configuration with notch at film side [Fig. 7(a)] or with the notch at the silicon side [Fig. 7(c)]; (b)–(d) XPS survey spectra of an asymmetric sample configuration with the notch on the film stack side [Fig. 7(b)] or with the notch on the Si side [Fig. 7(d)], recorded at each side of the fracture before (black curve) and after sputtering (gray curve).
(a) Typical load–displacement curves and corresponding fracture locations for a symmetric sample configuration with notch at the film stack side; (b) optical image of opened samples after four-point bending tests, when observing multiple plateaus.
Critical strain energy release rates for fractures along different polymer-M/metal barrier interfaces.
(a) FTIR spectra of polymer-M cured at different temperatures. The peak observed at 3300 cm−1 is due to C–H stretch provided by triple C-bonds.10 (b) Critical strain energy release rate vs UV cure temperature for three different metal barriers.
XPS depth profile of the polymer-M/TaN/Ta stack.
Details of the (a) Ta 4f, (b) O 1s and (c) C 1s spectra with respect to different etch times (depths) for the polymer-M/TaN/Ta stack.
(a) Critical strain energy release rate vs the TaN/Ta sputter bias; (b) C 1s spectra (normalized to the C–C peak) near the polymer/barrier interface for three different TaN/Ta sputter bias conditions.
Mechanical and optical properties of polymer-M.
Properties of different available CVD materials.
Adhesion results obtained for polimer-M/TaN/Ta/Copper film stack using three different sample configurations.
Optical and mechanical properties of polymer-M as a function of the UV cure temperature.
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