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Analysis the physical essence of microscopic fluid-based wear process in the chemical mechanical planarization process
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10.1063/1.3626798
/content/aip/journal/jap/110/6/10.1063/1.3626798
http://aip.metastore.ingenta.com/content/aip/journal/jap/110/6/10.1063/1.3626798
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(Color online) MD computation model.

Image of FIG. 2.
FIG. 2.

(Color online) Schematic of three-body abrasion.

Image of FIG. 3.
FIG. 3.

(Color online) MD simulation results of surface wear process at the nanoscale purple: particle 1, cyan: particle 2, pink: particle 3.

Image of FIG. 4.
FIG. 4.

(Color online) The stress distribution after planarization.

Image of FIG. 5.
FIG. 5.

(Color online) Variation of friction force between particle and substrate.

Image of FIG. 6.
FIG. 6.

(Color online) Variation of potential energy of substrate.

Image of FIG. 7.
FIG. 7.

(Color online) Dynamic track of particle tribology behavior.

Image of FIG. 8.
FIG. 8.

Cross-Sectional HRTEM images of silicon.

Image of FIG. 9.
FIG. 9.

(Color online) Atomic wear process at different speed.

Image of FIG. 10.
FIG. 10.

Wear rates of different speed.

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/content/aip/journal/jap/110/6/10.1063/1.3626798
2011-09-26
2014-04-19
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Analysis the physical essence of microscopic fluid-based wear process in the chemical mechanical planarization process
http://aip.metastore.ingenta.com/content/aip/journal/jap/110/6/10.1063/1.3626798
10.1063/1.3626798
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