(Color online) Schematic of the laser shock peening process.
Grain size of copper after annealing at 600 °C for an hour.
Surface nanocrystallization after RT-LSP (left) and CLSP (right) of Copper.
(Color online) Deformation twinning (as pointed by the arrows) after CLSP of copper.
(Color online) Twinning and calculated slip stress for copper as a function of temperature and strain rate.
Deformation twinning in Brass after RT-LSP; in (b) the diffraction pattern was taken from the (110) direction of the matrix, the two diffraction spots marked are from the twins.
(Color online) Relative dislocation density in copper for non-peened, RT-LSP, and CLSP.
(Color online) Representative DSC curves of the as-annealed, RT-LSP, and CLSP samples.
(Color online) Comparison of hardness for the non-peened sample and the samples after RT-LSP and CLSP.
(Color online) Relative dislocation density indicated by FWHM of the  peak, comparison between RT-LSP and CLSP after annealing at 200 °C for different times.
(Color online) Surface strength stability at annealing at 200 °C for the as-received (without annealing) sample and the sample after RT-LSP and CLSP.
(Color online) Nano-Indentation curves of the RT-LSP and the CLSP samples.
(Color online) Engineering stress-strain curves for non-peened, RT-LSP, and CLSP samples.
(Color online) Yield Stress, tensile strength and uniform elongation comparison for the non-peened sample, and the samples after RT-LSP and CLSP.
Constants in the ZA model.30
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