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Delayed mechanical failure of the under-bump interconnects by bump shearing
1. L. L. Mercado, C. Goldberg, K. Shun-Meen, T. T. Lee, and S. Pozer, Proceedings of the 53rd Electronic Components and Technology Conference, 2003, (2003), pp. 1784–1790.
3. C. Odegard, C. Tz-Cheng, C. Hartfield, and V. Sundararaman, Proceedings of the 55th Electronic Components and Technology Conference, 2005, (2005), pp. 1163–1171.
4. C. J. Zhai, U. Ozkan, A. Dubey, Sidharth R. C. , Blish, and R. N. Master, Proceedings of the 56th Electronic Components and Technology Conference, 2006 (2006), 9 pp.
5. W. Landers, D. Edelstein, L. Clevenger, C. Das, C. C. Yang, T. Aoki, F. Beaulieu, J. Casey, A. Cowley, M. Cullinan, T. Daubenspeck, C. Davis, J. Demarest, E. Duchesne, L. Guerin, D. Hawken, T. Ivers, M. Lane, X. Liu, T. Lombardi, C. McCarthy, C. Muzzy, J. Nadeau-Filteau, D. Questad, W. Sauter, T. Shaw, and J. Wright, Interconnect Technology Conference, 2004, Proceedings of the IEEE 2004 International (2004), pp. 108–110.
6. T. M. Shaw, E. Liniger, G. Bonilla, J. P. Doyle, B. Herbst, X. H. Liu, and M. W. Lane, International Interconnect Technology Conference, IEEE 2007 (2007), pp. 114–116.
8. X. H. Liu, T. M. Shaw, M. W. Lane, E. G. Liniger, B. W. Herbst, and D. L. Questad, International Interconnect Technology Conference, IEEE 2007 (2007), pp. 13–15.
9. L. L. Mercado, V. Sarihan, and T. Hauck, Electronic Components and Technology Conference, 50th Proceedings (2000), pp. 1332–1337.
10. Z. Jie-Hua, W. Brett, and U. Trent, AIP Conf. Proc. 741, 52–61 (2004).
18. Y. Li, I. Ciofi, L. Carbonell, G. Groeseneken, K. Maex, and Z. Tokei, in Moisture Related Low-K Dielectric Reliability Before and After Thermal Annealing, Phoenix, 2007.
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