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Patterning of templated-confined nanoscale Au films by thermal-induced dewetting process of a poly(methylmethacrylate) underlying layer
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10.1063/1.4771686
/content/aip/journal/jap/112/12/10.1063/1.4771686
http://aip.metastore.ingenta.com/content/aip/journal/jap/112/12/10.1063/1.4771686
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Scheme of the experimental configuration for the Au depositions. (b) and (c) Scheme of the used templates for the Au depositions ((b) refers to the G400 template, (c) to the G200HS template). (d) Optical photograph of a sample and a template before the Au depositions. (e) Optical photograph of a sample after an Au deposition.

Image of FIG. 2.
FIG. 2.

(a) Picture of the configuration of the template clamped against the sample at the edges: it is slightly elevated towards the center. (b) and (c) Pictures of the Au film pattern realized for opportunely low (b) or high (c) amount of deposited Au.

Image of FIG. 3.
FIG. 3.

(a) and (b) SEM images of the template confined deposited 20 nm (a) and 40 nm (b) thick Au film using the G400 mask. (c) and (d) SEM images of the template confined deposited 20 nm (c)and 40 nm (d) thick Au film using the G2000HS mask. (e) Cross-view picture of the patterned 20 nm thick Au film. (f) Cross-view picture of the patterned 40 nm thick Au film.

Image of FIG. 4.
FIG. 4.

Enlarged SEM images corresponding to the 20 nm thick Au film deposited using the G400 mask. In particular, in (c), the granular morphology of the Au film forming the squares is recognizable. In (d), the degrading edge of the Au square is recognizable so as the black region corresponding to the PMMA (non emitting region). (e) The cross-view picture of the Au film pattern.

Image of FIG. 5.
FIG. 5.

Enlarged SEM images corresponding to the 40 nm thick Au film deposited using the G400 mask. In particular, in (b), the partial interconnected Au squares are recognizable, and in (c), a morphology corresponding to a lower thickness Au layer. (d) The cross-view picture of the Au film pattern.

Image of FIG. 6.
FIG. 6.

Enlarged SEM images corresponding to the 20 nm thick Au film deposited using the G2000HS mask. In particular, in (b), the granular morphology of the Au film forming the squares is recognizable. In (c), a sharp transit from the Au square and the underlying PMMA is recognizable. (d) The cross-view picture of the Au film pattern.

Image of FIG. 7.
FIG. 7.

Enlarged SEM images corresponding to the 40 nm thick Au film deposited using the G2000HS mask. In particular, in (b), the granular morphology of the Au film forming the squares is recognizable, while (c) shows the morphology of the Au film partially interconnecting the squares. (d) The cross-view picture of the Au film pattern.

Image of FIG. 8.
FIG. 8.

SEM images of the patterned 20 nm thick Au film using the G400 mask and thermal processed at 200 °C for 3 h: (a) SEM image on a large scale; (b)cross-view picture of the morphology of a Au square after the thermal process; (c) enlarged SEM images of (a); (d) enlarged SEM image of (c) taken on a Au square near the edge to highlight the rims formation; (e) enlarged SEM image of (c) taken between Au squares to highlight the film rupture; (f) enlarged SEM image of (e) taken between Au squares to highlight the film contraction due to a dewetting phenomenon.

Image of FIG. 9.
FIG. 9.

(a)–(c) SEM images, on large scales, of the patterned 20 nm thick Au film using the G400 mask (a) and thermal processed at 200 °C for 3 h (b), and 300 °C for 3 h (c). These images allow to observe the film morphology evolution, on a large scale, as a function of the thermal budget. (d)–(h) Enlarged SEM images of a single Au square corresponding to the patterned 20 nm thick Au film using the G400 mask (d) and thermal processed at 200 °C for 3 h (e), 250 °C for 2 h (f), 300 °C for 2 h (g), and 300 °C for 3 h (h). These images allow to observe the morphology evolution of the single Au square as a function of the thermal budget.

Image of FIG. 10.
FIG. 10.

(a)–(c) SEM images, on large scales, of the patterned 40 nm thick Au film using the G400 mask and thermal processed at 200 °C for 2 h (a), 250 °C for 3 h (b), and 300 °C for 3 h (c). These images allow to observe the film morphology evolution, on a large scale, as a function of the thermal budget. (d)–(h) Enlarged SEM images corresponding to the patterned 40 nm thick Au film using the G400 mask and thermal processed at 200 °C for 2 h (d), 200 °C for 3 h (e), 250 °C for 3 h (f), 300 °C for 2 h (g), and 300 °C for 3 h (h). These images allow to observe the morphology evolution of singles Au squares as a function of the thermal budget.

Image of FIG. 11.
FIG. 11.

(a) SEM image, on a large scale, of the patterned 40 nm thick Au film using the G2000HS mask. (b)–(e) SEM images of the patterned 40 nm thick Au film using the G2000HS mask and annealed at 250 °C for 3 h: (b) large scale SEM image, (c) enlargement of (b), (d) enlargement of (c) to highlight the rims formation, and (e) enlargement of (d) to highlight the rupture of the Au film between the Au lines.

Image of FIG. 12.
FIG. 12.

(a)–(d) SEM images of the patterned 40 nm thick Au film using the G2000HS mask and annealed at 300 °C for 1 h: (a) large scale SEM image, (b) enlargement of (a), (c) enlargement of (b) to highlight the Au retraction by the dewetting phenomenon, and (d) enlargement of (c) to highlight the rims formation.

Image of FIG. 13.
FIG. 13.

(a)–(c) SEM images of the patterned 40 nm thick Au film using the G2000HS mask and annealed at 300 °C for 3 h: (a) and (b) large scale SEM images, (c) enlargement of (b). These images highlight the film degradation.

Image of FIG. 14.
FIG. 14.

(a) Model picture of the retraction phase of the PMMA during the dewetting process. (b) and (c) Cross-view pictures of the morphological evolution of the underlying PMMA film and on top Au film as a consequence of the thermal processes.

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/content/aip/journal/jap/112/12/10.1063/1.4771686
2012-12-21
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Patterning of templated-confined nanoscale Au films by thermal-induced dewetting process of a poly(methylmethacrylate) underlying layer
http://aip.metastore.ingenta.com/content/aip/journal/jap/112/12/10.1063/1.4771686
10.1063/1.4771686
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