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Effect of grain orientation in x-ray diffraction pattern on residual stress in polycrystalline ferroelectric thin film
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10.1063/1.4748052
/content/aip/journal/jap/112/4/10.1063/1.4748052
http://aip.metastore.ingenta.com/content/aip/journal/jap/112/4/10.1063/1.4748052

Figures

Image of FIG. 1.
FIG. 1.

The intermediate reference frames O-G 1 G 2 G 3 to describe the orientation in the crystal reference frame O-X 1 X 2 X 3 (a) and the specimen reference frame O-x 1 x 2 x 3 (b).

Image of FIG. 2.
FIG. 2.

Bragg diffraction at the specific planes within the irradiated region in polycrystalline thin film.

Image of FIG. 3.
FIG. 3.

Residual stresses in PZT thin films prepared by PLD (a), RF-MS (b), and MOD (c).

Image of FIG. 4.
FIG. 4.

The normal strain along the normal to an oblique plane ( plane).

Image of FIG. 5.
FIG. 5.

The theoretical analysis on residual stresses in PZT thin films prepared by PLD (a), RF-MS (b), and MOD (c).

Tables

Generic image for table
Table I.

Bragg angles and diffraction intensities for PZT powder and thin films.

Generic image for table
Table II.

Material parameters of the thin films.

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/content/aip/journal/jap/112/4/10.1063/1.4748052
2012-08-31
2014-04-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Effect of grain orientation in x-ray diffraction pattern on residual stress in polycrystalline ferroelectric thin film
http://aip.metastore.ingenta.com/content/aip/journal/jap/112/4/10.1063/1.4748052
10.1063/1.4748052
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