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Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging
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10.1063/1.4793516
/content/aip/journal/jap/113/17/10.1063/1.4793516
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/17/10.1063/1.4793516
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

(a) Temperature profile with eddy current only; (b) temperature profile with both eddy current power loss (3.56 × 10 W/layer) and magnetic power loss: 6 wt. % MNP (1.53 × 10 W/bump).

Image of FIG. 2.
FIG. 2.

(a) Temperature-location profile for different FeCo MNP concentrations (inset: A cross-section view of the temperature profile with 6 wt. % MNP); (b) temperature-time profile for different FeCo MNP concentrations.

Image of FIG. 3.
FIG. 3.

(a) Temperature-location profile for solder composite with 0.2 wt. % FeCo MNP in 1 MHz magnetic field at 50 s and in 3 MHz magnetic field at 4 s; (b) temperature-time profile for solder composite with 0.2 wt. % FeCo MNP in 1 MHz and 3MHz magnetic field.

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/content/aip/journal/jap/113/17/10.1063/1.4793516
2013-03-04
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/17/10.1063/1.4793516
10.1063/1.4793516
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