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Study of adhesion and chemical bonds in the reaction layer formed at Cu-Mn interconnection/SiO2 interface
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10.1063/1.4803500
/content/aip/journal/jap/113/17/10.1063/1.4803500
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/17/10.1063/1.4803500
/content/aip/journal/jap/113/17/10.1063/1.4803500
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/content/aip/journal/jap/113/17/10.1063/1.4803500
2013-05-02
2014-08-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Study of adhesion and chemical bonds in the reaction layer formed at Cu-Mn interconnection/SiO2 interface
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/17/10.1063/1.4803500
10.1063/1.4803500
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