1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Study of adhesion and chemical bonds in the reaction layer formed at Cu-Mn interconnection/SiO2 interface
Rent:
Rent this article for
USD
10.1063/1.4803500
/content/aip/journal/jap/113/17/10.1063/1.4803500
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/17/10.1063/1.4803500
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

The results of tape test using 8422B. The concentrations of Mn were 2%, 4%, 6%, 8%, and 10% and the thickness of Cu and Cu-Mn was 500 and 20 nm, respectively.

Image of FIG. 2.
FIG. 2.

Depth profiles of Cu/Cu-Mn/glass films after annealing at 320 °C for 5 min for (a) Cu (500 nm)/Cu-4 at. % Mn (20 nm)/glass and (b) Cu (500 nm)/Cu-10 at. % Mn (20 nm)/glass.

Image of FIG. 3.
FIG. 3.

Results of angle resolved XPS analysis. The incident angle of X-ray was 90°. O 1s for (a) Cu-4 at. Mn/glass and (b) Cu-10 at. % Mn/glass, Si 2p for (c) Cu-4 at. Mn/glass and (d) Cu-10at. % Mn/glass Si, Mn 3p for (e) Cu-4 at. Mn/glass and (f) Cu-10 at. % Mn/glass Mn 3p. Annealing condition was 320 °C 5 min. The results of deconvolution of the XPS spectra were also shown.

Image of FIG. 4.
FIG. 4.

Depth profiles of the interface region by EELS spectra.

Image of FIG. 5.
FIG. 5.

TEM-EELS spectra for (a) Si -edge, (b) O -edge, (c) Mn , and -edge. The adjacent points are separated by 1 nm in depth.

Image of FIG. 6.
FIG. 6.

The intensity ratio (I/I) of Mn -edge and Mn -edge as a function of the depth points. The value of (I/I) for Mn corresponds to 1.0, for MnO (Mn) to 1.9, for MnO (Mn and Mn) to 2.0, for MnO (Mn) to 1.5, and for MnO2 (Mn) to 1.6, respectively.

Image of FIG. 7.
FIG. 7.

Results of angle resolved XPS analysis for Si 2p. The incident angles of X-ray were 20°, 30°, 45°, 60°, and 90°.

Loading

Article metrics loading...

/content/aip/journal/jap/113/17/10.1063/1.4803500
2013-05-02
2014-04-17
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Study of adhesion and chemical bonds in the reaction layer formed at Cu-Mn interconnection/SiO2 interface
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/17/10.1063/1.4803500
10.1063/1.4803500
SEARCH_EXPAND_ITEM