Temperature-dependent electrical resistivity ρ(T) of the Ti50Ni50 and Ti50Ni45Cu5 alloys during cooling and warming process. The inset of Fig. 1(a) shows high-temperature ρ(T) of the Ti50Ni50 alloy in the cooling process.
Electrical resistivity as a function of temperature for Ti50Ni50- x Cu x (7.5 ≤ x ≤ 15) during cooling and warming cycles.
Temperature variations of electrical resistivity of Ti50Ni50- x Cu x (20 ≤ x ≤ 30) in the cooling and warming process.
Temperature-dependent Seebeck coefficient S(T) of the Ti50Ni50 and Ti50Ni45Cu5 alloys in the cooling and warming processes.
Seebeck coefficient as a function of temperature for Ti50Ni50- x Cu x (7.5 ≤ x ≤ 15) in the cooling and warming cycles. The inset of Fig. 5(b) shows high-temperature S(T) of the Ti50Ni40Cu10 alloy.
Temperature variations of Seebeck coefficient of Ti50Ni50- x Cu x (20 ≤ x ≤ 30) during cooling and warming processes.
Estimated Fermi energy (EF ) vs Cu content of the Cu doped TiNi alloys from high temperature Seebeck coefficient data.
(a) The value of M′s and Ms vs Cu content and (b) temperature of hysteresis behavior vs Cu content from Seebeck coefficient measurements.
Temperature-dependent total thermal conductivity κ(T) of parent TiNi alloy in cooling and warming process along with the electronic and lattice thermal conductivity in the warming.
Temperature-dependent lattice thermal conductivity κL (T) of the Ti50Ni50- x Cu x alloys in the warming process. Inset shows Cu content dependent relative change in the κ value (Δκ/κ) near Tm of the Cu doped TiNi-based alloys.
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