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Cu-substitution effect on thermoelectric properties of the TiNi-based shape memory alloys
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10.1063/1.4807397
/content/aip/journal/jap/113/20/10.1063/1.4807397
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/20/10.1063/1.4807397
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Temperature-dependent electrical resistivity () of the TiNi and TiNiCu alloys during cooling and warming process. The inset of Fig. 1(a) shows high-temperature () of the TiNi alloy in the cooling process.

Image of FIG. 2.
FIG. 2.

Electrical resistivity as a function of temperature for TiNi Cu (7.5 ≤ ≤ 15) during cooling and warming cycles.

Image of FIG. 3.
FIG. 3.

Temperature variations of electrical resistivity of TiNi Cu (20 ≤ ≤ 30) in the cooling and warming process.

Image of FIG. 4.
FIG. 4.

Temperature-dependent Seebeck coefficient () of the TiNi and TiNiCu alloys in the cooling and warming processes.

Image of FIG. 5.
FIG. 5.

Seebeck coefficient as a function of temperature for TiNi Cu (7.5 ≤ ≤ 15) in the cooling and warming cycles. The inset of Fig. 5(b) shows high-temperature () of the TiNiCu alloy.

Image of FIG. 6.
FIG. 6.

Temperature variations of Seebeck coefficient of TiNi Cu (20 ≤ ≤ 30) during cooling and warming processes.

Image of FIG. 7.
FIG. 7.

Estimated Fermi energy () vs Cu content of the Cu doped TiNi alloys from high temperature Seebeck coefficient data.

Image of FIG. 8.
FIG. 8.

(a) The value of M′ and M vs Cu content and (b) temperature of hysteresis behavior vs Cu content from Seebeck coefficient measurements.

Image of FIG. 9.
FIG. 9.

Temperature-dependent total thermal conductivity () of parent TiNi alloy in cooling and warming process along with the electronic and lattice thermal conductivity in the warming.

Image of FIG. 10.
FIG. 10.

Temperature-dependent lattice thermal conductivity () of the TiNi Cu alloys in the warming process. Inset shows Cu content dependent relative change in the value (/) near of the Cu doped TiNi-based alloys.

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/content/aip/journal/jap/113/20/10.1063/1.4807397
2013-05-23
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Cu-substitution effect on thermoelectric properties of the TiNi-based shape memory alloys
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/20/10.1063/1.4807397
10.1063/1.4807397
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