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On the dynamics of Cu ions injection into low-k nanoporous materials under oscillating applied fields
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10.1063/1.4775798
/content/aip/journal/jap/113/3/10.1063/1.4775798
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/3/10.1063/1.4775798
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Structure for tests and geometry for simulation.

Image of FIG. 2.
FIG. 2.

(a) Experimental leakage profile during dynamic bipolar applied stress. (b) Bipolar applied field represented by Eapp = A[Sign(sin(2πft))], where A = 3.5 MV/cm and f = 0.016 Hz.

Image of FIG. 3.
FIG. 3.

Simulations for transient Cu depth profiles. Eapp = ±2.5 MV/cm, f = 0.05 Hz. Ce = 7 × 1025 at/m3, D = 4.2 × 10−19m2/s, α = 2 × 10−44 J m3.

Image of FIG. 4.
FIG. 4.

Experimental data and simulation for time to breakdown vs. frequency for Cu, T = 200 °C, Ce = 7 × 1025 at/m3, D = 4.2 × 10−19 m2/s, α = 2 × 10−44 J m3.

Image of FIG. 5.
FIG. 5.

Weibull distributions of time to fail for MIS structures tested under DC and 1 Hz bipolar applied fields at 200 °C.

Image of FIG. 6.
FIG. 6.

Simulation for time to breakdown vs. frequency for various ionic solubilities. Eapp = ±3.5 MV/cm, T = 200 °C, D0 = 3.75 × 10−12 m2/s, α = 2 × 10−44 J m3.

Image of FIG. 7.
FIG. 7.

Simulation on time to breakdown vs. frequency for various ionic mobilities. Eapp = ±3.5 MV/cm, T = 200 °C, Ce = 1.0 × 1026 ion/m3, α = 2 × 10−44 J m3, L = 200 × 10−9 m.

Image of FIG. 8.
FIG. 8.

Simulation for electric field at SiCOH/Si interface (cathode). Time to breakdown for constant applied field is tBD = 2 min. tBD for bipolar applied field (f = 0.03 Hz) is tBD = 42 min. Time to breakdown for temperature stress is tBD = 174 min. Ce = 7 × 1025 at/m3, D = 4.2 × 10−19 m2/s, α = 2 × 10−44 J m3.

Image of FIG. 9.
FIG. 9.

Simulation for Cu depth profiles for temperature stress and fast alternating bipolar applied field. Eapp = ±2.5 MV/cm, f = 10 Hz, t = 8 min, Ce = 7 × 1025 at/m3, D0 = 4.2 × 10−19 m2/s, α = 2 × 10−44 J m3.

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/content/aip/journal/jap/113/3/10.1063/1.4775798
2013-01-16
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: On the dynamics of Cu ions injection into low-k nanoporous materials under oscillating applied fields
http://aip.metastore.ingenta.com/content/aip/journal/jap/113/3/10.1063/1.4775798
10.1063/1.4775798
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